This suite contains non-destructive analysis equipment such as x-ray inspection machine, scanning acoustic (C-SAM) and IR microscopes. These equipment are used for the non-destructive characterization of IC packages, BGAs, Flip chips, Bonded wafers, PCBs, Ceramic/ metals/ plastic components & compounds, Material characterization & analysis, Medical devices & structures etc. The x-ray imaging machine is capable of 3D CT scanning which can be used to construct a 3D movie depicting internal structure of a component. The C-SAM machine is equipped with several transducers and amplifiers for high resolution imaging of internal structures of a wide range of packages in pulse echo and transmission modes. The IR microscope gives thermal maps to identify hot spots on an active circuit in a system, and can also be used in a thermal transient mode to study fast thermal phenomena.
