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Program Title:
The Small Scale Systems Integration and Packaging Center

Description:

The Small Scale Systems Integration and Packaging Center (S3IP), a New York state Center of Excellence, is dedicated to the creation and development of new electronic applications that will enhance the way people live and interact with their surroundings. Located at Binghamton University, the Center brings together partners from the federal and state governments, industry and academia, providing opportunities for collaborative projects that will advance microelectronics research and development and facilitate technology transfer to New York state companies.

Center Components:
  • The Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology, is internationally renowned for its leading edge research in electronics packaging. The Center is focused on traditional electronics packaging research, including materials, thermal, mechanical, chemical and electrical analyses for the packaging industry. The IEECís research program, sponsored by the federal and state governments, and industrial sponsors, currently tops over $5M annually. Industrial sponsors include Analog Devices, AMD, ASE, BAE, Corning, Endicott Interconnect, General Electric, IBM, Lockheed Martin, Samsung, SPIL and Universal Instruments.
    http://www2.binghamton.edu/ieec/
  • The Center for Energy-Smart Electronic Systems collaborates with government, industry and academic partners on the development of new energy design models to improve the efficiency and security of our nation's data centers and electronic systems.
    http://www.binghamton.edu/es2
  • The Center for Autonomous Solar Power conducts research on new, large-area, flexible, light-weight solar cells to meet scientific challenges in reducing the cost of solar power and enhancing energy efficiency. http://www2.binghamton.edu/casp
  • The Center for Advanced Microelectroics Manufacturing (CAMM), is a national roll-to-roll (R2R) manufacturing R&D center, dedicated to demonstrating the feasibility of R2R flexible electronics manufacturing by acquiring prototype tools and establishing processes capable of producing low-volume, test-bed products.
    http://camm.binghamton.edu
  • S3IP offers a suite of expertise and infrastructure to its partners, (including the Analytical and Diagnostics Laboratory and failure and reliability laboratories) which enable the commercialization of microelectronics technologies by providing instrument and technical support for failure analysis, and for characterizing material, processes and devices.



    Web Site:  http://s3ip.binghamton.edu

    Contact:

    Bahgat Sammakia
    Director
    Tel: 607-777-6880
    bahgat@binghamton.edu

    Binghamton University
    The Small Scale Systems Integration and Packaging Center
    PO Box 6000
    Binghamton, NY 13902-6000