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The 2011 Electronics Packaging Symposium is scheduled for Monday, October 10-Tuesday, October 11, 2011. More Information.


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The Center for Advanced Microelectronics Manufacturing (CAMM)

The Center for Advanced Microelectronics Manufacturing (CAMM), a partnership between Binghamton University (BU), Endicott Interconnect Technologies (EI), Cornell University and the Flex Tech Alliance, is the nation’s first prototype research and development (R&D) facility in large area flexible electronics. The CAMM is part of BU’s New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP), which serves as an international resource for systems integration and packaging R&D.

Our vision, to be an international leader in flexible electronics research and development, is enabled through our partnerships with government, academia and industry, which provide unique opportunities for collaboration to advance the development of next generation roll-to-roll (R2R) and printed flexible electronics manufacturing capabilities.

For additional information, please contact us at (607) 777-5314.

 

 

 

 

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000
©2012  The Small Scale Systems Integration and Packaging Center at Binghamton University.
The CAMM is a component of the Small Scale Systems Integration and Packaging Center, a
New York State Center of Excellence. All rights reserved.

Last Updated: 8/11/11