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1.     Flick, Ernest W., Adhesives, Sealants and Coatings for the Electronics Industry (Second Edition), Noyes Publications, Park Ridge, NJ, 1992, ISBN 0-8155-1295-3.

 2a.     Advances in Thermal Modeling of Electronic Components and Systems, Volume 1 (2 copies) (Eds. Avram Bar-Cohen and Allan D. Kraus), Hemisphere Publishing Corporation, New York, NY, 1988. ISBN 0-89116-689-0.

 2b.     Advances in Thermal Modeling of Electronic Components and Systems, Volume 2 (Eds. Avram Bar-Cohen and Allan D. Kraus), ASME Press, New York, NY, 1990. ISBN 0-7918-0015-6.

 2c.   Advances in Thermal Modeling of Electronic Components and Systems, Volume 3 (Eds. Avram Bar-Cohen and Allan D. Kraus), ASME Press, New York, NY, 1993. ISBN 0-7918-0018-0.

 2d.   Advances in Thermal Modeling of Electronic Components and Systems, Volume 4 (Eds. Avram Bar-Cohen and Allan D. Kraus), ASME Press, New York, NY, 1998. ISBN 0-7918-0065-2.

 3.     number replaced by 2b.

 4.     Terano, Toshiro; Asai, Kiyoji; and Sugeno, Michio, Applied Fuzzy Systems, Academic Press Professional, Cambridge, Massachusetts, 1989, ISBN 0-12-685242-1.

 8.     Rahn, Armin, The Basics of Soldering, John Wiley & Sons, Inc., New York, NY, 1993, ISBN 0-471-58471-1.

 9.     Characterization of Integrated Circuit Packaging Materials (Eds. Thomas M. Moore and Robert G. McKenna), Butterworth-Heinemann, Boston, MA, 1993, ISBN 0-7506-9267-7.

11.   Bakoglu, H.B., Circuits, Interconnections, and Packaging for VSLI (two copies), Addison-Wesley Publishing Company, New York, NY, 1990, ISBN 0-201-16008-6.

13.   Dictionary of Scientific and Technical Terms (Fifth Edition), (Ed. in Chief, Sybil P. Parker), McGraw-Hill, New York, NY, 1994, ISBN 0-07-042333-4.

14.   Kavanagh, Paul, Downsizing for Client/Server Applications, Academic Press Professional, Cambridge, Massachusetts, 1995, ISBN 0-12-402680-X.

15.   Electronic Materials Handbook: Volume I, Packaging, ASM International Handbook Committee, Materials Park, OH, 1989, ISBN 0-87170-285-1 (v. 1).

16.   Landers, Thomas L.; Brown, William D.; Fant, Earnest W.; Malstrom, Eric M.; Schmitt, Neil M., Electronics Manufacturing Processes, Prentiss-Hall, Englewood Cliffs, NJ, 1994, ISBN 0-13-176470-5.

17.   Harper, Charles A. and Sampson, Ronald M., Electronic Materials & Processes Handbook (Second Edition), McGraw-Hill, Inc., 1994. ISBN 0-07-054299-6.

18.   Electronic Packaging and Interconnection Handbook (two copies) (Ed. in Chief, Charles A. Harper), McGraw-Hill, Inc., New York, NY, 1991, ISBN 0-07-026684-0.

19.   Electronics Packaging Forum: Volume 1 (three copies) (Ed. James E. Morris), Van Nostrand Reinhold, New York, NY, 1990, ISBN 0-442-0017809 (v.1).

20.   Electronics Packaging Forum: Volume 2 (three copies) (Ed. James E. Morris), Van Nostrand Reinhold, New York, NY, 1991, ISBN 0-442-00476-1 (v.2).

21.   Electronics Packaging Forum: Multichip Module Technology Issues (two copies) (Ed. James E. Morris), IEEC Press, New York, NY, 1994, ISBN 0-7803-0439-X.

22.   Tittel, E. and Robbins, M., E-mail Essentials, Academic Press, Inc., AP Professional, Cambridge, MA, 1994, ISBN 0-12-691397-8.

23.   Engineered Materials Handbook: Volume 1, Composites, (two copies) ASM International, 1987. ISBN 0-87170-279-7 (v. 1), SAN 204-7586.

24.   Engineered Materials Handbook: Volume 2, Engineering Plastics, ASM International, 1988. ISBN 0-87170-279-7 (v. 1), SAN 204-7586.

25.   Engineered Materials Handbook: Volume 3, Adhesives and Sealants, ASM International, 1990. ISBN 0-87170-279-7 (v. 1), SAN 204-7586, ISBN 0-87170-281-9.

26.   Engineered Materials Handbook: Volume 4, Ceramics and Glasses, ASM International, 1991. ISBN 0-87170-282-7, SAN 204-7586.

27.   Marcoux, Phil P., Fine Pitch Surface Mount Technology: Quality, Design, and Manufacturing Techniques, Van Nostrand Reinhold, New York, NY, 1992, ISBN 0-442-00862-7.

28.   Fjelstad, Joseph, Flexible Circuit Technology, Silicon Valley Publishers Group, Campbell, CA 1994.

29.   Stearns, Thomas H., Flexible Printed Circuitry, McGraw-Hill, New York, 1996, ISBN 0-07-061032-0.

31.   McNeill, F. Martin and Thro, Ellen, Fuzzy Logic: A Practical Approach, Academic Press Professional, Cambridge, Massachusetts, 1994, ISBN 0-12-485965-8.

32.   Cox, Earl, The Fuzzy Systems Handbook: A Practitioner's Guide to Building, Using, and Maintaining Fuzzy Systems, Academic Press Professional, Cambridge, Massachusetts, 1994, ISBN 0-12-194270-8.

36.   Handbook of Electronic Package Design (Ed. Michael Pecht), Marcel Dekker, Inc., 1991. ISBN 0-8247-7921-5.

37.   Matisoff, Bernard S., Handbook of Electronics Packaging Design and Engineering (Second Edition), Van Nostrand Reinhold, New York, NY, 1990, ISBN 0-442-26502-6.

38.   Handbook of Fine Pitch Surface Mount Technology (two copies) (Ed. John H. Lau), Van Nostrand Reinhold, 1994. ISBN 0-442-01258-6.

39.   Handbook of Plastics, Elastomers, and Composites (Second Edition), (Ed. Charles A. Harper), McGraw-Hill, New York, NY, ISBN 0-07-026686-7.

40.   Handbook of Tape Automated Bonding (Ed. John H. Lau), Van Nostrand Reinhold, New York, NY, 1992. ISBN 0-442-00427-3.

41.   Johnson, Howard W. And Graham, Martin, High-Speed Digital Design: A Handbook of Black Magic, Prentice Hall PTR, New Jersey, 1993, ISBN 0-13-395724-1.

42.   Licari, James J. and Enlow, Leonard R., Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production, Noyes Publications, Park Ridge, NJ, 1988, ISBN 0-8155-1152-3.

43.   Hybrid Microelectronics Handbook (Second Edition), (Eds. Jerry E. Sergent and Charles A. Harper), McGraw-Hill, Inc., New York, NY, 1995, ISBN 0-07-026691-3.

44.   Pecht, Michael, Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, John Wiley & Sons, Inc., 1994, ISBN 0-471-59446-6.

54.   Microelectronics Packaging Handbook (two copies) (Eds. Rao R. Tummala and Eugene J. Rymaszewski), Van Nostrand Reinhold, New York, NY, 1989. ISBN 0-442-20578-3.

71.   Seraphim, Donald P.; Lasky, Ronald; and Li, Che-Yu, Principles of Electronic Packaging, (four copies) McGraw-Hill Book Company, New York, NY, 1989, ISBN 0-07-056306-3.

73.   Stevens, Roger T., Quick Reference to Computer Graphics Terms, Academic Press Professional, Cambridge, Massachusetts, 1993, ISBN 0-12-668310-7.

74.   Reliability Assessment of Wafer Scale Integration Using Finite Element Analysis, Rome Laboratory, Griffiss AFB, NY, October 1991.

75.   Harman, George G., Reliability and Yield Problems of Wire Bonding in Microelectronics, International Society for Hybrid Microelectronics, 1991. ISBN 0-930815-25-4.

76.   Rome Laboratory Reliability Engineer's Toolkit: An Application Oriented Guide for the Practicing Reliability Engineer, Systems Reliability Division, AFMC, Griffiss AFB, NY, 1993.

79.   Manko, Howard H., Soldering Handbook for Printed Circuits and Surface Mounting (Second Edition), Van Nostrand Reinhold, New York, 1994, ISBN 0-442-01206-3.

80.   Judd, Mike and Brindley, Keith, Soldering in Electronics Assembly, BH Newness, East Kilbride, Scotland, 1992, ISBN 0-7506-0589-8.

82.   Manko, Howard H., Solders and Soldering: Materials, Design, Production, and Analysis for Reliable Bonding, McGraw-Hill, Inc., 1992. ISBN 0-07-039970-0.

83.   Julien, Christian and Nazri, Gholam-Abbas, Solid State Batteries: Materials Design and Optimization, Kluwer Academic Publishers, Boston, MA, 1994. ISBN 0-7923-9460-7.

85.   Suhir, Ephraim, Structural Analysis in Microelectronic and Fiber-Optic Systems: Volume I, Van Nostrand Reinhold, New York, NY, 1991. ISBN 0-442-20771-9.

86.   Engel, Peter A., Structural Analysis of Printed Circuit Board Systems, Springer-Verlag, New York, Mechanical Engineering Series, 1993. ISBN 0-387-97939-5, ISBN 3-540-97939-5.

87.   Surface Mount Technology (Greg Caswell, Organizer), The International Society for Hybrid Microelectronics, Silver Spring, MD, 1984 (two copies). ISBN 0-930815-00-9.

88.   Classon, Frank, Surface Mount Technology for Concurrent Engineering and Manufacturing, McGraw-Hill, Inc. 1993. ISBN 0-07--11200-2.

89.   Surface Mount Technology: Recent Japanese Developments (Ed. Jan Vardaman), IEEE Press, New York, NY, 1993. ISBN 0-7803-0407-1.

91.   Thermal Stress and Strain in Microelectronics Packaging (Ed. John H. Lau); Van Nostrand Reinhold, 1993. ISBN 0-442-01058-3.

92.   Messner, George; Turlik, Iwona; Balde, John W.; Garrou, Philip E., Thin Film: Multichip Modules, International Society of Hybrid Microelectronics, Reston, VA, 1992. ISBN 0-930815-33-5.

93.   Perry, Douglas L., VHDL (Second Edition), McGraw-Hill, Inc., New York, NY, 1994. ISBN 0-07-049434-7.

94.   Pick, Joseph, VHDL Techniques, Experiments, and Caveats, McGraw-Hill, Inc., New York, NY, 1996. ISBN 0-07-049906-3.

95.   Steinberg, Dave S., Vibration Analysis for Electronic Equipment (Second Edition), John Wiley & Sons, New York, NY, 1988. ISBN 0-471-63301-1.

97.   Advances in Thermal Modeling of Electronic Components and Systems, Volume 3 (eds. Avram Bar-Cohen and Allan D. Kraus), ASME Press, New York, 1993. ISBN 0-7918-0018-0.

98.   Corrosion Control by Coatings (ed. H. Leidheiser, Jr.), Science Press, Princeton, 1979. ISBN 0-89500-018-0.

99.   Koch, Winston E., Engineering Applications of Lasers and Holography, Plenum Press, New York, 1975. ISBN 0-306-30849-5.

100. Hinch, Stephen W., Handbook of Surface Mount Technology, Longman Scientific & Technal, Essex, England, 1988. ISBN 0-582-00517-5.

101. Mandelkern, Leo, An Introduction to Macromolecules, Springer-Verlag, New York, 1972. ISBN 0-387-90045-4.

102 Brisky, Michael, Mastering SMT Manufacturing, SMT Plus, Inc., (Company publication).

103. Materials for Electronic Packaging (ed. Deborah D.L. Chung), Butterworth Heinemann, Boston, 1995, ISBN 0-7506-9314-2.

104. Microelectronics Packaging Handbook: Technology Drivers (Part I) (Second Edition), (Rao E. Tummala, Eugene J. Rymasewski and Alan G. Klopfenstein, eds.), Chapman & Hall, New York, 1997. ISBN 0-412-08431-7.

105. Microelectronics Packaging Handbook: Semiconductor Packaging (Part II) (Second Edition), (Rao E. Tummala, Eugene J. Rymasewski and Alan G. Klopfenstein, eds.), Chapman & Hall, New York, 1997. ISBN 0-412-08441-4.

106. Microelectronics Packaging Handbook: Subsystem Packaging (Part III) (Second Edition), (Rao E. Tummala, Eugene J. Rymasewski and Alan G. Klopfenstein, eds.), Chapman & Hall, New York, 1997. ISBN 0-412-08451-1.

107. Lea, C., A Scientific Guide to Surface Mount Technology, Electrochemical Publications, Ayr, Scotland, 1988. ISBN 0-901150-22-3.

108. Prasad, Ray P., Surface Mount Technology: Principles and Practice, Van Nostrand Reinhold, New York, 1989. ISBN 0-442-20527-9.

109. Prasad, Ray P., Surface Mount Technology: Principles and Practice (Second Edition), (2 copies) Chapman & Hall, New York, 1997. ISBN 0-412-12921-3.

111. Harper, Charles A., Electronic Packaging & Interconnection Handbook (Second Edition), McGraw Hill, New York, 1997. ISBN 0-07-026694-8.

114. Licari, James J., Multichip Module Design, Fabrication, & Testing, McGraw Hill, New York, 1995, ISBN 0-07-037715-4.

115. Alvino, William M., Plastics for Electronics: Materials, Properties, and Design Applications, McGraw Hill, 1995. ISBN 0-07-001435-3.

116. Quality Conformance and Qualification of Microelectronic Packages and Interconnects (Michael Pecht, Abhijit Dasgupta, John W. Evans and Jillian Y. Evans, eds.), John Wiley & Sons, New York, 1994. ISBN 0-471-59436-9.

117. Harman, George, Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield, McGraw Hill, New York, 1997. ISBN 0-07-032619-3.

118. Packaging, Intel Corp., Intel Publications, Mt. Prospect, IL, 1997, ISBN 1-55512-264-7.

119. Fjelstad, Joseph, An Engineer’s Guide to Flexible Circuit Technology, Electrochemical Publications, 1997. ISBN: 0-901150-43-7.

120. Smart Cards: Seizing Strategic Business Opportunities (Catherine Allen and William J. Barr, eds.), Irwin Professional Publishing, Chicago, IL, 1997. ISBN 0-7863-1108-8.

121. Elshabini-Riad, Aicha, and Fred D. Barlow III, Thin Film Technology Handbook, (2 copies) McGraw-Hill, New York, NY, 1997. ISBN 0-07-019025-9.

122. Manufacturing Challenges in Electronic Packaging (eds.Y.C. Lee, and W.T. Chen), Chapman & Hall, London, U.K., 1998. ISBN 0-412-62030-8.

123. Konsowski, Stephen G., and Arden R. Helland, Electronic Packaging of High Speed Circuitry, McGraw-Hill, New York, NY, 1997. ISBN 0-07-035970-9.

124. DiGiacomo, Giulio, Reliability of Electronic Packages and Semiconductor Devices, McGraw-Hill, New York, NY, 1996. ISBN 0-07-017024-X.

125. Jawitz, Martin W., Printed Circuit Board Materials Handbook, McGraw-Hill, New York, NY, 1997. ISBN 0-07-032488-3.

126. Design & Reliability of Solders and Solder Interconnections, (eds. R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, PlK. Liaw, W.L. Winterbottom) TMS Minerals Metals Materials, Warrendale, PA (1997). ISBN: 0-87339-354-6.

127. Lao, John H. and Yi-Hsin Pao, Solder Joint Reliability of BGA, u, Flip Chip and Fine Pitch SMT Assemblies, McGraw-Hill, New York, 1997. ISBN 0-07-036648-9.

128. Srihari, K., C.R. Emerson, S. Krishnan, Y. Hwang, C.H. Wu, and C.W. Yeh, A ‘Design for Manufacturing’ Environment for Surface Mount PCB Assembly, A concise user’s guide. Dept. of Mech. and Industrial Engr., Watson School, SUNY Binghamton.

130.  Connectors and Interconnections Handbook, Volume 1: Basic Technology (Gerald L. Ginsberg, ed.), The Electronic Connector Study Group, Inc. Fort Washington, PA, 1977. Lib. Congress No. 77-088086.

131.  Connectors and Interconnections Handbook, Volume 4: Materials (Gerald L. Ginsberg, ed.), The Electronic Connector Study Group, Inc. Fort Washington, PA, 1983.

132.  Metals Handbook, Volume 1, Properties and Selection: Irons and Steels (Ninth Edition), (Bruce P. Bardes, Ed.), American Society of Metals, 1978. ISBN 0-87170-7.

133.  Metals Handbook, Volume 2, Properties and Selection: Nonferrous Alloys and Pure Metals (Ninth Edition), (Bruce P. Bardes, Ed.), American Society of Metals, 1979. ISBN 0-87170-008-5.

134.  Metals Handbook, Volume 3, Properties and Selection: Stainless Steels, Tool Materials and Special-Purpose Metals (Ninth Edition), (Bruce P. Bardes, Ed.), American Society of Metals, 1980. ISBN 0-87170-009-3

135.  Tool and Manufacturing Engineers Handbook (Third Edition), (Daniel B. Dallas, Ed.-in-Chief), McGraw-Hill Book Co.,1976. ISBN 0-07-059558-5.

136.  Gabriel, B.L., SEM: A User’s Manual for Materials Science, American Society for Metals, 1985. ISBN 0-87170-202-9.

137.  Topics in Current Physics: Thin Film and Depth Profile Analysis (H. Oechsner, Ed.), Springer-Verlag, New York, 1984. ISBN 0-387-13320-8.

138.  Sterling, D.J., Jr., Technician’s Guide to Fiber Optics, Delmar Publishers Inc. 1987. ISBN 0-8273-2612-2.

139.  Senior, J.M., Optical Fiber Communications: Principles and Practice, Prentice-Hall, 1985. ISBN 0-130638248 7.

140.  Pecht, Michael G., et al., Electronic Packaging Materials and their Properties, (two copies) CRC Press LLC, New York, 1999. ISBN 0-8493-9625-5.

142.  Liu, Johan, Conductive Adhesives for Electronics Packaging, Electrochemical Publications, Isle of Man, British Isles, 1999. ISBN 0-901150-37-1.

143.  Engineering Plastics & Composites (Second Edition), (William Andrew Woishnis, Ed.) ASM International, Materials Park, OH, 1993. ISBN 0-87170-483-8.

145.  The Electronic Packaging Handbook (Glenn R. Blackwell, Ed.), CRC Press, Boca Ratan, FL, 1999. ISBN 0-8493-8501-1.

146.  Advanced Electronic Packaging: With Emphasis on Multichip Modules (William Brown, ed.), IEEE Press, Piscataway, NJ, 1999. ISBN 0-7803-4700-5.

147.  Marks’ Standard Handbook for Mechanical Engineers (Tenth Edition), (Eugene A. Avallone, Theodore Baumeister III, Eds.), McGraw-Hill, New York, NY, 1996. ISBN 0-07-004997-1

148.  Shewhart, Walter A., Statistical Method from the Viewpoint of Quality Control, Dover Publications, Inc., New York, 1986. ISBN 0-486065232-7.

149.  Optoelectronic Packaging (Alan R. Mickelson, Nagesh R. Basavanhally, Yung Cheng Lee, eds.), John Wiley & Sons, Inc, New York, 1997. ISBN 0-471-11188-0.

150.  Failure Analysis of Integrated Circuits: Tools and Techniques (Lawrence C. Wagner, ed.), Kluwer Academic Publishers, Boston/Dordrecht/London, 1999. ISBN 0-412-14561-8.

152.  High Temperature Electronics (eds. F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak), CRC Press, New York, NY, 1997, ISBN 0-8493-9623-9.

153.  Lyshevski, Sergey Edward, Nano- and Microelectromechanical Systems: Fundamentals of Nano- and Microengineering, CRC Press, New York, NY, 2001. ISBN 0-8493-916-6.

154.  Remsburg, Ralph, Thermal Design of Electronic Equipment, CRC Press, New York, NY, 2001, ISBN 0-8493-0082-7.

155.  Prospering in a Global Economy: Linking Trade and Technology Policies (Eds. Martha Caldwell Harris and Gordon E. Moore), National Academy Press, Washington, DC, 1992. ISBN 0-309-0464509.

156.  Microelectronics (Ed. Jerry C. Whitaker), CRC Press, Boca Raton, FL, 2000. ISBN 0-8493-0050-9.

158.  Technology Transfer in Consortia and Strategic Alliances (Eds. David V. Gibson and Raymond W. Smilor), Rowman & Littlefield Publishers, Inc., Lanham, MD, 1992. ISBN 0-8476-7717-6.

161.  Chigrinov, V.G., Liquid Crystal Devices: Physics and Applications, Artech House, Boston, MA, 1999. ISBN 0-89006-894-4.

170.  Fundamentals of Microsystems Packaging (ed. Rao Tummala), McGraw-Hill, New York, NY, 2001. ISBN 0-07-137169-9.

189.  Cheng, David K., Field and Wave Electromagnetics, Addison-Wesley Publishing Co., Inc., Reading, MA, 1983. ISBN 0-201-01239-1.

190.  Magid, Leonard M., Electromagnetic Fields, Energy, and Waves, John Wiley & Sons, New York, NY, 1972. ISBN 0-471-56334-X.

191.  Panofsky, Wolfgang K., Phillips, Melba, Classical Electricity and Magnetism, Second Edition, Addison-Wesley Publishing Co., Inc., Reading, MA, 1962. . Lib. of Congress Catalog Card No. 61-10973.

192   Shadowitz, Albert, The Electromagnetic Field, McGraw-Hill, New York, NY, 1975. ISBN 0-07-056368-3.

193.  Mark, Melvin, Arthur R. Foster, Thermodynamics: Principles and Applications, Allyn and Bacon, Inc., Boston, MA, 1979. ISBN 0-205-06631-3.

194.  Bellows, Guy, Chemical Machining: Production with Chemistry, Second Edition, Metcut Research Associates, Inc., Cincinnati, OH, 1982. ISBN 0-936974-08-7.

195.  Svedberg, The, Colloid Chemistry, Second Edition, J.J. Little and Ives, Co., New York, NY 1928.

196.  Klir, George J., Tina A Folger, Fuzzy Sets, Uncertainty, and Information, Prentiss Hall, Englewood Cliffs, NJ, 1988. ISBN 0-13-345984-5.

197.  Oldenberg, Otto, Introduction to Atomic Physics, McGraw-Hill, New York, NY, 1949.

198.  Flinn, Richard A., Fundamentals of Metal Casting, Addison-Wesley Publishing Co., Inc., Reading, MA, 1963. Lib. of Congress Catalog Card No. 61-6128.

199.  Vill’, V.I., Friction Welding of Metals (trans. from Russian), American Welding Society, New York, NY, 1962. Lib. of Congress Catalog Card No. 62-13420.

200.  Resistance Welding Committee, Resistance Welding: Theory and Use, American Welding Society, New York, NY, 1956. Lib. of Congress Catalog Card No. 56-9808.

201.  Dieter, George E., Engineering Design: A Materials and Processing Approach, McGraw-Hill, New York, NY, 1991. ISBN 0-07-016906-3.

202.  Ruoff, Arthur L., Introduction to Materials Science, Prentiss Hall, Englewood Cliffs, NJ, 1972. ISBN 0-13-487355-6.

203.  Keyser, Carl A., Materials: Science in Engineering, Second Edition, Charles E. Merrill Publishing Co., Columbus, OH, 1968. ISBN 0-675-08883-6.

204.  Odqvist, Folke K.G., Mathematical Theory of Creep and Creep Rupture, Oxford University Press, Glasgow, UK, 1966.

205.  Compressed Air and Gas Data, Second Edition (ed. Charles W. Gibbs), Ingersoll-Rand Co., Woodcliff Lake, NJ, 1971.

207.  Rosenberg, Ronald C., Dean C. Karnopp, Introduction to Physical System Dynamics, McGraw-Hill, New York, NY, 1983. ISBN 0-07-053905-7.

208.  MacMillan, William Duncan, Theoretical Mechanics: The Theory of the Potential, Dover Publications, New York, NY, 1958. SBN 486-60486-1.

209.  Guy, Albert G., Physical Metallurgy for Engineers, Addison-Wesley Publishing Co., Inc., Reading, MA, 1962. Lib. of Congress Catalog Card No. 62-11792.

210.  Clement, Preston R., Walter C. Johnson, Electrical Engineering Science, McGraw-Hill, New York, NY, 1960. Lib. of Congress Catalog Card No. 59-15457.

211.  Abraham, Max, The Classical Theory of Electricity and Magnetism, Second Edition (rev. Richard Becker, Translation, John Dougall), Hafner Publishing, New York, NY, 1949.

212.  Cogan, Edward J., Robert Z. Norman, Handbook of Calculus, Difference and Differential Equations, Prentice-Hall, Englewood Cliffs, NJ, 1958. Lib. of Congress Catalog Card No. 58-7321.

213.  Potts, J. Frank, J. Walter Oler, Finite Element Applications with Microcomputers, Prentice-Hall, Englewood Cliffs, NJ, 1989. ISBN 0-13-317439-5.

214.  Kraus, John D., Electromagnetics, Third Edition, McGraw-Hill, New York, NY, 1984. ISBN 0-07-035423-5.

215.  IEEE, 1983 Student Papers, Piscataway, NJ, 1983, TT0120-6.

216.  Baker, D., D.C. Koehler, W.O. Fleckenstein, C.E. Roden, R. Sabia, Physical Design of Electronic Systems, Volume III: Integrated Device and Connection Technology, Prentice-Hall, Englewood Cliffs, NJ, 1971. ISBN 0-13-666370-2.

217.  Metals Handbook Committee, Metals Handbook, Von Hoffman Press, 1936.

218.  Conductive Adhesives for Electronics Packaging (ed. Johan Liu), Electrochemical Publications Ltd., British Isles, 1999. ISBN: 0-901150-37-1.

219.  Douglas, Bodie E., McDaniel, Darl H., Concepts and Models of Inorganic Chemistry, Blaisdell Publishing Co., Waltham, MA, 1965. Library of Congress Catalog Card No. 65-14572

220.  McNaughton, J.L., Mortimer, C.T., Differential Scanning Calorimetry, Perkin-Elmer, Norwalk, CT, 1975. L-604.

221.  Berne, Bruce J., Pecora, Robert, Dynamic Light Scattering, with Applications to Chemistry, Biology, and Physics, John Wiley & Sons, New York, NY, 1976. ISBN: 0-471-07100-5.

222.  Ruden, Alfred, The Elements of Polymer Science and Engineering: An Introductory Text for Engineers and Chemists, Academic Press, New York, NY, 1982. ISBN: 0-12-601680-1.

223.  Rabek, Jan F., Experimental Methods in Polymer Chemistry, John Wiley & Sons Ltd., Bristol, UK, 1980. ISBN: 0-471-27604-9.

224.  Watson, Thomas J., Jr., Petre, Peter, Father Son & Co.: My Life at IBM and Beyond, Bantam Books, New York, NY, 1990. ISBN: 0-553-07011-8.

225.  Hertzberg, Richard W., Manson, John A., Fatigue of Engineering Plastics, Academic Press, New York, NY, 1980. ISBN: 0-12-343550-1.

226   Lee, Henry, and Nevuille, Kris, Handbook of Epoxy Resins, McGraw-Hill, New York, NY, 1967. Library of Congress Catalog Card No. 65-26165.

227.  Allen, P.E.M., Patrick, C.R., Kinetics & Mechanisms of Polymerization Reactions: Applications of Physico-chemical Principles, Halstead Press, New York, NY, 1974. ISBN 0-470-02320-1.

228.  Lau, John H., Low Cost Flip Chip Technologies for CDA, WLCSP, and PBGA Assemblies, McGraw-Hill, 2000. ISBN: 0-07-1351412-8.

229.  Brown, Paul L., Managing Behavior on the Job, John Wiley & Sons, New York, NY, 1982. ISBN: 0-471-86516-8.

230.  Rabek, Jan F., Mechanisms of Photophysical Processes and Photochemical Reactions in Polymers: Theory and Applications, John Wiley & Sons, New York, NY, 1987. ISBN: 0-471-91180-1.

231.  Coxon, J.M., Halton, B., Organic Photochemistry, Cambridge University Press, New York, NY, 1974. ISBN: 0-521-20322-8.

232.  Photochemistry -- Past, Present and Future (eds. R.P. Wayne, J.D. Coyle), Elsevier Sequoia S.A., Lausanne, The Netherlands, 1984. ISBN: 0-444-75025-8.

233.  Olabisi, Olagoke, Robeson, Lloyd M., Shaw, Montgomery T., Polymer-Polymer Miscibility, Academic Press, New York, NY, 1979. UISBN: 0-12-525050-9.

234.  Winter, Caryl, Present Yourself with Impact: Techniques for Success, Ballantine Books, New York, NY, 1983. ISBN: 0-345-30338-5.

235.  vanKrevelen, D.W., Hoftyzer, P.J., Properties of Polymers: Correlations with Chemical Structure, Elsevier Publishing Co., New York, NY. 1972. ISBN: 0-444-40955-6.

236.  Box, George E.P., Hunter, William G., Hunter, J. Stuart, Statistics for Experimenters: An Introduction to Design, Data Analysis, and Model Building, John Wiley & Sons, New York, NY, 1978. ISBN: 0-471-09315-7.

237.  Painter, Paul C., Coleman, Michael M., Koenig, Jack L., The Theory of Vibrational Spectroscopy and its Application to Polymeric Materials, John Wiley & Sons, New York, NY, 1982. ISBN: 0-471-09346-7.

239.  Peters, Tom, Thriving on Chaos: Handbook for a Management Revolution, Alfred A. Knopf, New York, NY, 1987. ISBN: 0-394-56784-6.

240.  A Practical Guide to UV Curing in Screen Printing for Printed Circuits & the Graphic Arts (eds. Steven G. Wentink, Stanley D. Koch), Technology Marketing Corp., Norwalk, CT, 1981. ISBN: 0-936840-00-5.

241.  Sze, S.M., Physics of Semiconductor Devices, 2nd Edition (2 copies), John Wiley & Sons, New York, NY, 1981. ISBN: 0-471-05661-8.

242.  Wear Control Handbook (eds. M.B. Peterson and W.O. Winer), ASME, 1980. Library of Congress No. 80-68846.

243.  Mitchell, F.H. Jr., Mitchell, F.H. Sr., Introduction to Electronics Design, Prentice Hall, Englewood Cliffs, NJ, 1988. ISBN 0-13-481276-X.

244.  Bar-Lev, Adir, Semiconductors and Electronic Devices, 2nd Edition, Prentice Hall, Englewood Cliffs, NJ, 1984. ISBN: 0-13-806265-X.

245.  Wang, Shyh, Fundamentals of Semiconductor Theory and Device Physics, Prentice Hall, Englewood Cliffs, NJ, 1989. ISBN: 0-13-344409-0.

246.  Flexible Flat Panel Displays (ed. Gregory P. Crawford), John Wiley & Sons, Ltd., Chichester, England, 2005. ISBN-13: 978-0-470-87048-8, ISBN-10: 0-470-87048-6.

247.  Lead-free Electronics (ed. Sanka Ganesan, Michael Pecht), Wiley Interscience, Hoboken, NJ, 2006, ISBN-13 978-0-471-78617-7, ISBN-10 0-471-78617-9.

248.  Scott, K.J., Practical Simulation of Printed Circuit Boards and Related Structures, John Wiley & Sons Inc., New York, NY, 1994, ISBN 0 471 95085 8.

249.  Paul, Clayton R., Analysis of Multiconductor Transmission Lines, Wiley Interscience, Hoboken, NJ, 1994, ISBN 0-471-02080-X.

250.  Matick, Richard E., Transmission Lines for Digital and Communication Networks, An Introduction to Transmission Lines, High-frequency and Hi-speed Pulse Characteristics and Applications, McGraw-Hill Book Co., New York, NY, 1969, Library of Congress Catalog Card No. 68-30561.

251.  Kwok, H.L., Electronic Materials, PWS Publishing Co., Boston, MA, 1997, ISBN 0-534-93048-1.

252.  Dally, James W., Packaging of Electronic Systems: A Mechanical Engineering Approach, McGraw-Hill Book Co., New York, NY, 1990, ISBN 0-07-015214-4.

253.  Hummel, Rolf E., Electronic Properties of Materials, Third Edition, Springer-Verlag, New York, NY, 2001, ISBN 0-387-95144-X.

255.  Thin Film Multichip Modules, George Messner, Iwona Turlik, John W. Balde, Philip E. Garrou, International Society for Hybrid Microelectronics, Reston, VA, 1992, ISBN 0-930815-33-5.

256.  Chip on Board: Technologies for Multichip Modules, (ed. John H. Lau), Van Nostrand Reinhold, New York, NY, 1994, ISBN 0-442-01441-4.

257.  Bishop, Robert H., Learning with LabVIEW, Addison Wesley, Menlo Park, CA, 1999, ISBN 0-201-36166-3.

258.  Tummala, Rao R., Fundamentals of Microsystems Packaging, McGraw-Hill Book Co., New York, NY, 2001, ISBN 0-07-137169-9.

259.  FE/EIT Fundamentals of Engineering/Engineer-in-Training - AM Exam, Research & Education Association, Piscataway, NJ, 1998, ISBN 0-87891-077-8.

260.  Besterfield, Dale H., Quality Control, Prentice Hall, Inc., Englewood Cliffs, NJ, 1994, ISBN 0-13-501115-9.

261.  Breyfogle, Forrest W., III, Implementing Six Sigma, Second Edition, John Wiley & Sons, Inc., Hoboken, NJ, 2003, ISBN 0-471-26572-1.

262.  Anderson, Virgil L. and McLean, Robert A., Design of Experiments: A Realistic Approach, Marcel Dekker, Inc., New York, NY, 1974, ISBN 0-8247-7493-0.

263.  Breyfogle, Forrest W., III, Cupello, James M. and Meadows, Becki, Managing Six Sigma, John Wiley & Sons, Inc., Hoboken, NJ, 2001, ISBN 0-471-39673-7.

264.  Tibor, Tom and Feldman, Ira, ISO14000: A Guide to the New Environmental Management Standards (2 copies), Irwin Professional Publishing, Chicago, IL, 1996, ISBN 0-7863-0523-1.

265.  Devore, Jay L., Probability and Statistics for Engineering and the Sciences, Third Edition, Brooks/Cole Publishing Co., Belmont, CA, 1991, ISBN0-534-14352-0.

266.  Box, George E.P., Hunter, William G., Hunter, J. Stuart, Statistics for Experimenters: An Introduction to Design, Data Analysis, and Model Building, John Wiley & Sons, Inc., New York, NY, 1978, ISBN 0-471-09315-7.

267.  Slater, John C., and Frank, Nathaniel H., Electromagnetism, McGraw-Hill Book Co., New York, NY, 1947.

268.  Read, W.T., Jr., Dislocations in Crystals, McGraw-Hill Book Co., New York, NY, 1953, Library of Congress Catalog Card No. 53-6049.

269.  Benyon, C.E., The Physical Structure of Alloys, Edward Arnold & Co., London, England, 1945.

270.  Powell, C.F., Campbell, I.E., and Gonser, B.W., Vapor-Plating: The Formation of Coatings by Vapor-Deposition Techniques, John Wiley & Sons, Inc., New York, NY, 1955, Library of Congress Catalog Card No. 55-8244.

271.  Shockley, William, Electrons and Holes in Semiconductors: With Applications to Transistor Electronics, D. Van Nostrand Co., Inc., New York, NY, 1950.

272.  Progress in Operations Research, Vol. I, (ed. Russell L. Ackoff), John Wiley & Sons, Inc.,1961, Library of Congress Catalog Card No. 61-10415.

273.  American Institute of Physics Handbook (ed. Dwight E. Gray), McGraw-Hill Book Co., Inc., New York, NY, 1957.

274.  Kennard, Earle H., Kinetic Theory of Gases: With an Introduction to Statistical Mechanics, McGraw-Hill Book Co., Inc., New York, NY, 1938.

275.  Creep and Recovery, A Seminar held during the thirty-eighth National Metal Congress and Exposition, Cleveland, OH, October 6-12, 1956, copyright 1957.

276.  Jaswon, M.A., The Theory of Cohesion, Interscience Publishers Inc., New York, NY, 1954.

277.  Harman, George G., Reliability and Yield Problems of Wire Bonding in Microelectronics, International Society for Hybrid Microelectronics, Reston, VA, 1989. ISBN: 0-930815-25-4.

278.  Owen, George E. and Keaton, P.W., Fundamentals of Electronics, Vol. III, Harper & Row, New York, NY, 1967, Library of Congress Catalog Card No. 66-14170.

279.  Handbook of Physics (ed. E.U. Condon and Hugh Odishaw), McGraw-Hill Book Co., Inc., New York, NY, 1958, Library of Congress Catalog Card No. 57-6387.

280.  Publications of the National Bureau of Standards, July 1, 1957 to June 30, 1960, United States Department of Commerce, National Bureau of Standards Miscellaneous Publication 240, 1961, Government Printing Office, Washington, DC.

281.  Publications of the National Bureau of Standards, 1901 to June 30, 1947, National Bureau of Standards Circular 460, 1948, Government Printing Office, Washington, DC.

282.  King, Ronold W.P., Transmssion-line Theory, Dover Publications, New York, NY, 1965, Library of Congress Catalog Card No. 64-8269.

283.  Bewley, L.V., Traveling Waves on Transmission Systems, Dover Publications, New York, NY, 1951, Library of Congress Catalog Card No. 63-21810.

284.  Handbook of Tables for Applied Engineering Science, 2nd Edition (eds. Ray E. Bolz, George L. Tuve), CRC Press, Cleveland, OH, 1973, ISBN 0-87819-252-2.

285.  Harman, George G., Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science, International Society for Hybrid Microelectronics, Reston, VA, 1989, ISBN 0-930815-25-4.

286.  DeForest, W.S., Photoresist: Materials and Processes, McGraw-Hill Book Company, New York, NY, 1975, ISBN 0-07-016230-1.

287.  U.S. Department of the Army, Basic Theory and Application of Transistors, Dover Publications, Inc., New York, NY 1963.

288.  Budden, K.G., The Wave-Guide Mode Theory of Wave Propagation, Prentice-Hall, Inc., Englewood Cliffs, NJ, 1961.

289.  Harrison, A.E., Klystron Technical Manual, Sperry Gyroscope Company, Inc., Brooklyn, NY, 1944.

290.  Lauer, Henri, Lesnick, Robert, Mastson, Leslie E., Servomechanism Fundamentals, McGraw-Hill Book Company, Inc., New York, NY, 1947.

291.  Slater, J. C., Microwave Transmission, McGraw-Hill Book Company, Inc, New York, NY, 1942.

292.  Progress in Metal Physics (Eds. Bruce Chalmers, R. King), Pergamon Press, Ltd., London & New York, 1956.

293.  Collin, Robert E., Zucker, Francis J., Antenna Theory: Part II, McGraw-Hill Book Company, Inc, New York, NY,1969, Library of Congress Catalog Card No. 68-8031.

294.  American National Standards Institute, IEEE Standard Dictionary of Electrical and Electronics Terms, Wiley-Interscience, New York, NY, 1972.

295.  Staff of Research and Education Association, The Electromagnetics Problem Solver, Research and Education Association, New York, NY, 1983, ISBN 0-87891-550-8.

296.  Dielectric Materials and Applications (Ed. Arthur R. Von Hippel), The Technology Press of M.I.T., and John Wiley & Sons, Inc., New York, NY, 1954, Library of Congress Catalog Card No. 54-11021.

297.  Tufte, Edward R., Envisioning Information, Graphics Press, Chesire, CT, 1990.

298.  Tufte, Edward R., The Visual Display of Quantitative Information, Graphics Press, Chesire, CT, 1982.

299.  Gallium Arsenide: Materials, Devices, and Circuits (Eds. M.J. Howes and D.V. Morgan), John Wiley & Sons, New York, NY, 1985, ISBN 0-471-90048-6.

300.  Kelly, Gerard, The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, Kluwer Academic Publishers, Boston, MA, 1999, ISBN 0-7923-8485-7.

301.  Sandborn, Peter A., Moreno, Hector, Conceptual Design of Multichip Modules and Systems, Kluwer Academic Publishers, Boston, MA, 1994, ISBN 0-79234-9395-3.

302.  Ott, Henry W., Noise Reduction Techniques in Electronic Systems, John Wiley & Sons, New York, NY, 1976, ISBN 0-471-65726-3

303.  Ott, Henry W., Noise Reduction Techniques in Electronic Systems, Second Edition, John Wiley & Sons, New York, NY, 1988, ISBN 0-471-85-68-3.

304.  Guillet, George L., Kinematics of Machines, John Wiley & Sons, New York, NY, 1948, 4th Edition.

305.  Suhir, Ephraim, Lee, Y.C., Wong, C.P., Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Volume 1, Springer Science + Business Media, Inc., New York, NY, 2007, ISBN 0-387-32989-7.

306.  Suhir, Ephraim, Lee, Y.C., Wong, C.P., Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Volume 1, Springer Science + Business Media, Inc., New York, NY, 2007, ISBN 0-387-32989-7.

307.  Hill, Terry, Manufacturing Strategy: Text & Cases, Irwin, Boston MA, 1994, ISBN0-256-10666-5.

 

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