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Proceedings

 

Library Listing: Proceedings

1.       Progress in Quality Electronic Components,Washington, DC, May 5-7, 1952.

2.       1954 Electronic Components Symposium, Washington, DC, May 4-6, 1954.

3.       1962 Electronic Components Conference, Washington, DC, May 8-10, 1962.

4.       1963 Electronic Components Conference, Washington, DC, May 7-9, 1963.

5.       1965 Electronic Components Conference, Washington, DC, May 5-7, 1965.

6.       1966 Electronic Components Conference, Washington, DC, May 4-6, 1966.

7.       1967 Electronic Components Conference, Washington, DC, May 3-5, 1967.

8.       1968 Electronic Components Conference, Washington, DC, May 8-10, 1967.

9.     1969 Electronic Components Conference, Washington, DC, April 30-May 2, 1969.

10.     21st Electronic Components Conference, Washington, DC, May 10-12, 1971.

11.   23rd Electronic Components Conference, Washington, DC, May 14-16, 1973.

12.     24th Electronic Components Conference, Washington, DC, May 13-15, 1974.

13.     25th Electronic Components Conference, Washington, DC, May 12-14, 1975.

14.     26th Electronic Components Conference, San Francisco, CA, April 26-28, 1976

15.     27th Electronic Components Conference, Arlington, VA, May 16-18, 1977.

16.     28th Electronic Components Conference, Anaheim, CA, April 24-26, 1978.

17.     29th Electronic Components Conference, Cherry Hill, NJ, May 14-16, 1979.

18.     30th Electronic Components Conference, San Francisco, CA, April 28-30, 1980.

19.     31st Electronic Components Conference, Atlanta, GA, May 11-13, 1981.

20.     33rd Electronic Components Conference, Orlando, FL, May 16-18, 1983.

21.     35th Electronic Components Conference, Washington, DC, May 20-22, 1985.

22.     36th Electronic Components Conference, Seattle, WA, May 5-7, 1986 (two copies).

23.     37th Electronic Components Conference, Boston, MA, May 11-13, 1987.

24.     38th Electronic Components Conference, Los Angeles, CA, May 9-11, 1988.

25.     39th Electronic Components Conference, May 22-24, 1989, Houston, TX.

26.     40th Electronic Components Conference (vols. 1 & 2), Las Vegas, NV, May 20-23, 1990.

27.     41st Electronic Components & Technology Conference, May 11-16, 1991, Atlanta, GA (two copies).

28.     42nd Electronic Components & Technology Conference, May 18-20, 1992, San Diego, CA.

29.     43rd Electronic Components & Technology Conference, June 1-4, 1993, Orlando, FL.

30.     44th Electronic Components & Technology Conference, May 1-4, 1994, Washington, DC.

31.     45th Electronic Components & Technology Conference, May 21-24, 1995, Las Vegas, NV.

32.     46th Electronic Components & Technology Conference, May 28-31, 1996, Orlando, FL.

33.     47th Electronic Components & Technology Conference, May 18-21, 1997, San Jose, CA.

33a.     Solder Joint Reliability of SMT Assemblies: BGA, CSP, DCA, Flip Chip and FPT, 1997 IEEE/EIA Technical Seminar.

34.     ALCEM at 3M, August 3-4, 1995, St. Paul, MN.

35.     ARPA Electronic Packaging and Interconnect Conference, February 27-28, 1995, Arlington, VA.

36.     ASM Materials Developments in Microelectronic Packaging: Performance and Reliability, August 19-22, 1991, Montreal, Que., Canada.

37.     113th ASME Winter Annual Meeting, “Concurrent Engineering,” Final Program, November 8-13, 1992, Anaheim, CA.

38.     Ball Grid Array/Flip Chip Workshop: Technical Program Abstracts (3 copies), Oct. 19-21, 1994, Binghamton, NY.

39.     ASME-JSME Thermal Engineering Joint Conference 1995, Volume 4; March 19-24, 1995, Maui, HI.

40.     EIA Multichip Module Division Industry Assessment Workshop: Assembly and Packaging, March 9-10, 1995, DFW Airport.

41.     IEPS Eighth Annual International Electronics Packaging Conference, November 7-10, 1988, Dallas, TX.

42.     IEPS Ninth Annual International Electronics Packaging Conference (two volumes),

43.     September 11-13, 1989, San Diego, CA.

44.     IEPS Selections from the 1991 International Electronics Packaging Conference, September 15-18, 1991, San Diego, CA.

45.     IEPS 1993 International Electronics Packaging Conference (two volumes), September 12-

46.     15, 1993, San Diego, CA.

47.     IEPS 1994 International Electronics Packaging Conference, September 25-28, 1994, Atlanta, GA.

48.     IEPS 1995 International Electronics Packaging Conference, September 24-27, 1995, San Diego, CA.

49.     1995 International Flip Chip, Ball Grid Array, Tab and Advanced Packaging Symposium: ITAP ‘95, San Jose, CA, February 14-17, 1995, San Jose, CA.

51.     NEPCON WEST ‘92, Volumes 1, 2, 3, Conference February 23-27, 1992, Exposition

52.     February 25-27, 1992, Anaheim, CA.

54.     NEPCON WEST ‘94, Volumes 1, 2, 3; Conference February 27-March 4, 1994;

55.     Exposition March 1-3, 1994, Anaheim, CA.

57.     14th Capacitor and Resistor Technology Symposium, CARTS ‘94, March 21-24, 1994, Jupiter, FL.

58.     15th Capacitor and Resistor Technology Symposium, CARTS ‘95, March 13-16, 1995, San Diego, CA.

59.     IEEE International Symposium on Circuits and Systems, Volume 3 of 4, May 1-3, 1990, New Orleans, LA.

60.     SPIE-The International Society for Optical Engineering, “Optoelectronic Interconnects,” January 18-20, 1993, Los Angeles, CA.

63.     Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium, February 10-12, 1988, San Diego, CA.

64.     Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium, February 7-9, 1989, San Diego, CA.

65.     Sixth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium, February 6-9, 1990, Phoenix, AZ.

66.     Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium, February 12-14, 1991, Phoenix, AZ.

67.     Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, February 3-5, 1992, Austin, TX.

68.     Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, February 2-4, 1993, Austin, TX.

69.     Tenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, February 1-3, 1994, San Jose, CA.

70.     Eleventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium, February 7-9, 1995, San Jose, CA.

71.     ISHM International Symposium on Microelectronics, November 9-11, 1993, Dallas, TX.

72.     ISHM International Symposium on Microelectronics, November 15-17, 1994, Boston, MA.

73.     ISHM International Symposium on Microelectronics, October 24-26, 1995, Los Angeles, CA.

74.     Technical Program, Surface Mount International Conference & Exposition, “Apart from the Crowd” (two volumes), August 29-September 3, 1993, San Jose, CA.

75.       Technical Program, Surface Mount International Conference & Exposition, August 28-September 1, 1994, San Jose, CA.

76.     Presentations by Surface Mount Council, Surface Mount International Conference & Exposition, August 28-September 1, 1994, San Jose, CA.

77.   Status of the Technology Industry Activities and Action Plan (Ed. David Bergman), presented at the Surface Mount International Conference & Exposition, San Jose, California, August 28-September 1, 1994.

78.     Surface Mount International, Advanced Electronics Manufacturing Technologies, September 8-12, 1996, San Jose, CA.

79.     Surface Mount Council Presentation at Surface Mount International, September 8-12, 1996, San Jose, CA.

80.     IEMT Symposium: The Keys to Manufacturing in the 1990’s, Eleventh IEEE/CHMT International Electronics Manufacturing Symposium, September 16-18, 1991, San Francisco, CA.

81.     IEMT Symposium: Volume 1: Technical Papers, Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, September 12-14, 1994, La Jolla, CA.

82.     IEMT Symposium: Volume 2: Product Demonstrations, Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, September 12-14, 1994, La Jolla, CA.

83.     Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, “Manufacturing Technologies - Present and Future,” October 2-4 1995, Austin, TX, IEEE Catalog Number 95CH35864.

84.     Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 14-16, 1996, Austin, TX, IEEE Catalog Number 96CH35997.

85.     7th International Microelectronics Conference (SHM), June 3-5, 1992, Yokohama, Japan.

86.     IPC National Conference, “Flip Chip and Chip Scale Packaging of ICs,” Volumes I and II,

87.     May 13-14, 1996, Raleigh, NC.

            “Chip Scale and Flip Chip: A Solution to the DCA Problem?” Jim Hayward, Advanced Micro Devices, presented at the IPC National Conference

            “Emerging Flip Chip Infrastructure,” Paul Magill, MCNC, keynote address at the IPC National Conference

88.     IEEE BGA/Flip Chip Workshop, Technical Program Abstracts, October 23-25, 1996, Binghamton, NY.

89.     NIST, IEEE, VHMT, VLSI Packaging Workshop, October 11-13, 1993, Yorktown Heights, NY.

90.     ISHM New England 20th Annual Symposium & Exhibition, May 20, 1993, Andover, MA.

91.     International Conference on Multichip Modules (ISHM/IEPS), April 1-3, 1992, Denver, CO

92.     International Conference and Exhibition on Multichip Modules (ISHM/IEPS), April 14-16, 1993, Denver, CO.

93.     International Conference on Multichip Modules (ISHM/IEPS), April 13-15, 1994, Denver, CO.

94.     International Conference on Multichip Modules (ISHM/IEPS), April 19-21, 1995, Denver, CO.

95.     Technology Marketing Research Council 1994 Program, Volumes 1 (June) and 2

96.     (December), 1994, Washington, D.C.

97.     Technology Marketing Research Council 1996 Program, Volumes 1 (June) and 2

98.     (December), 1996, Washington, D.C.

99.     International Intersociety Packaging Conference -- INTERpack ‘95: Advances in

100.   Electronic Packaging 1995, Volumes 1 and 2, March 26-30, 1995, Lahaina, Maui, HI.

101.   Program Directory & Product Guide, Semicon West 97; San Francisco, CA, July 10-17; San Jose, CA, July 15-22, 1997.

102.   Components, Hybrids, and Manufacturing Technology Society of the IEEE, 38th IEEE Holm Conference on Electrical Contacts, October 18-21, 1992, Philadelphia, PA.

103.   IEMT Symposium, Proceedings, October 14-16, 1996, Austin, TX.

103.   First Annual Wireless & Portable Design Conference, September 15-18, 1997, Burlington, MA.

104.   Soldering Technology for Electronics Packaging Symposium, November 12-13, 1990, Sponsored by the Office of Continuing Education, Watson School, Binghamton University. (2 copies)

105.   Soldering Technology for Electronics Packaging Symposium, June 11-12, 1992, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

106.   Sixth Annual Soldering Technology for Electronics Packaging Symposium, September 27-28, 1993, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

107.   Seventh Annual Soldering Technology for Electronics Packaging Symposium, October 17-18, 1994, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

108.   Eighth Annual Soldering Technology for Electronics Packaging Symposium - 1995, October 30-31, 1995, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

110.   Fourth Annual Electronics Packaging Symposium, April 5-6, 1993, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

111.   Fifth Annual Electronics Packaging Symposium, July 18-19, 1994, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

112.   Sixth Annual Electronics Packaging Symposium, July 13-14, 1995, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

113.   Eighth Annual Electronics Packaging Symposium, June 26-27, 1997, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

114.   Tenth Anniversary Microprocessor Forum, San Jose, CA, October 14-16, 1997.

115.   NSF S/IUCRC Symposium, University of Oklahoma, Norman, OK, September 3-5, 1997.

116.   Technology Marketing Research Council 1996 Program, Volumes 1 (June) and 2

117.   (December), 1996, Washington, D.C.

118.   Flat Panel Display Workshop, Rensselaer Polytechnic Institute, Troy, NY, June 11, 1996.

120.   Ninth Annual Soldering Technology for Electronics Packaging Symposium, October 21-22, 1996, Binghamton, NY, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

121.   Seventh Annual Electronics Packaging Symposium, June 27-28, 1996, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

122.   1998 Digest of Technical Papers, Solid-State Circuits Conference, Sponsored by the IEEE International, February 5-7, 1998, San Francisco, CA.

123.   Slide Supplement to the1998 Digest of Technical Papers, Solid-State Circuits Conference, Sponsored by the IEEE International, February 5-7, 1998, San Francisco, CA.

124.   NEPCON West ’98, Technical Program, Vol. 1, March 1-5, 1998, Anaheim, CA.

125.   NEPCON West ’98, Technical Program, Vol. 2, March 1-5, 1998, Anaheim, CA.

126.   NEPCON West ’98, Technical Program, Vol. 3, two copies, March 1-5, 1998, Anaheim, CA.

127.   American Society for Engineering Education, 1994 College Industry Education Conference, “Strategies for Success”, January 31-February 4, 1993, San Antonio, TX

128.   Ninth Annual Electronics Packaging Symposium, June 15-16, 1998, Sponsored by the Office of Continuing Education, Watson School, Binghamton University.

129.   IEMT-Europe 1998, International Electronics Manufacturing Technology Symposium Proceedings, April 27-29, 1998, Berlin, Germany.

130.   ISHM International Symposium on Microelectronics, October 15-17, 1990, Chicago, IL.

131.   NEPCON East ’97, Technical Program, Ball Grid Array National Symposium, June 9-12, Boston, MA.

132.   3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, IEEE CPMT Society, Binghamton, NY, September 28-30, 1998.

135.   3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, IEEE CPMT Society, Binghamton, NY, September 28-30, 1998.

134.   Proceedings of ASM’s 3rd Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Electronic Packaging and Corrosion in Microelectronics (ed. Morris E. Nicholson), Minneapolis, MN, April 28-30, 1987.

136.   Surface Mount International Conference & Exposition, August 23-27, 1998, San Jose, CA.

137.   Proceedings of the IPC/SMTA Electronics Assembly Expo (2 copies), Providence, RI, October 24-29, 1998.

138.   State/Industry/University Cooperative Research Centers Symposium, University of Oklahoma, September 3-5, 1997, Norman, OK.

139.   IEEE 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, September 28-30, 1998.

140.   ECTC 48th Electronic Components & Technology Conferenc, (2 copies), Seattle, WA, May 25-28, 1998.

141.   IMAPS New England 25th Annual Symposium & Exhibition, Andover, MA, May 14, 1998.

142.   IPC 41st Annual Meeting, Long Beach, CA, April 26-30, 1998.

143.   1996 International Flip Chip, Ball Grid Array, Tab and Advanced Packaging Symposium, ITAP ’96, Sunnyvale, CA, February 14-16, 1996.

144.   11th International Electronics Manufacturing Technology Symposium, “The Keys to Manufacturing in the 1990’s,” San Francisco, CA, September 16-18, 1991.

145.   Second International TAB Symposium, San Jose, CA, February 5-7, 1990.

(Minutes) IPC/SMTA Electronics Assembly Expo ’98, Providence, RI, October 24-29, 1998.

 

Nepcon West ’99, Volume I, Anaheim, CA, February 21-25, 1999.

Nepcon West ’99, Volume II, Anaheim, CA, February 21-25, 1999.

Nepcon West ’99, Volume III, Anaheim, CA, February 21-25, 1999.

 

150.     SEMI Technical Programs: International Packaging Strategy Symposium (IPSS), San Francisco, CA, July 17, 1996.

151.     SEMI Technical Educational Program: Taiwan Packaging Seminar, Hsinchu, Taiwan R.O.C., September 14, 1995.

152.     ECTC 49th Electronic Components & Technology Conference (2 copies), San Diego, CA, June 1-4, 1999.

            a.         Chip Scale Package (CSP) Technical Seminar

            b.         Wafer Scale Packaging Technical Seminar

153.     Interpack ’99, Advances in Electronic Packaging, Vol. 1, The Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, Maui, HI, June 13-19, 1999.

154.     Interpack ’99, Vol. 2.

155.     1998 ASME International Mechanical Engineering Congress and Exposition, Anaheim, CA, November 15-20, 1998.

156.     IPC Printed Circuits Expo ’99 Proceedings, Long Beach, CA, March 14-18, 1999.

            Class W-18, “PWB Microsectioning Essentials”

            Class W-21, “CSP, BGA and Fine Pitch Peripheral Interconnections”

157.     ITherm ’98, The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, WA, May 27-30, 1998.

158.     1999 Conference Proceedings, Get Connected, SMTA International, San Jose, CA, September 12-16, 1999.

159.     Technology Marketing Research Council 1997 Program, Volumes 1 (June) and 2

160.     (December), 1997, Washington, D.C.

161.     Technology Marketing Research Council 1998 Program, Volumes 1 (June) and 2

162.     (December), 1998, Washington, D.C.

163.     Interpack ’95, Advances in Electronic Packaging, Vol. 1:

164.     Interpack ’95, Advances in Electronic Packaging, Vol. 2, Lahaina, Maui, HI, March 26-30, 1995.

165.     Interpack ’97, Advances in Electronic Packaging, Vol. 1:

166.     Interpack ’97, Advances in Electronic Packaging, Vol. 2, Kona Coast, HI, June 15-19, 1997.

167.     29th Annual Proceedings, IEEE Reliability Physics 1991, Las Vegas, NV, April 9-11, 1991.

168.     30th Annual Proceedings, IEEE Reliability Physics 1992, San Diego, CA, March 31-April 2, 1992.

169.     31st Annual Proceedings, IEEE Reliability Physics 1993, Atlanta, GA, March 23-25, 1993.

170.     1992 Proceedings of the Annual Reliability and Maintainability Symposium, ASQC, Las Vegas, NV, January 21-23, 1992.

171.     1993 Proceedings of the Annual Reliability and Maintainability Symposium, ASQC, Atlanta, GA, January 25-28, 1993.

172.     HDI Expo Proceedings, Mesa, AZ, August 23-25, 1999.

            Tutorial Paper, “Overview of Chip Scale and Wafer Level Packaging Technologies.”

173.     24th International Symposium for Testing and Failure Analysis, ISTFA 1998, Dallas, TX, November 15-19, 1998.

174.     IPC Works ’99, International Summit on Lead-Free Electronics Assemblies, Minneapolis, MN, October 23-28, 1999.

175.     12th Annual Symposium, Lead-Free Soldering and Interconnection Symposium, SUNY Binghamton, Binghamton, NY, December 6-8, 1999.

176.     2000, Proceedings of the Technical Conference, Long Beach, CA, March 12-16, 2000.

177.     IPC Works ‘99, Minneapolis, MN, October 23-28, 1999.

178.     IPC Printed Circuits Expo, Proceedings of the Technical Conference, San Diego, CA, April 4-6, 2000.

            Tutorial T-04, “Fabricating Advanced PWBs Using Build-Up Technologies,” Vols. 1 & 2.

            Workshop W-06, “High Density Base Material Alternatives.”

179.     Proceedings, HDI Conference & Exhibition on High Density Interconnect and Systems Packaging, Denver, CO, April 25-28, 2000.

            Professional Development Course Materials, April 25,

180.     IEPS 1991 International Electronics Packaging Conference (two volumes), September

181.   15-18, 1991, San Diego, CA.

182.     IEPS 1992 International Electronics Packaging Conference (two volumes), September

183.   27-30, 1992, San Diego, CA.

184.     The Technical Proceedings of SMTCON + MCM, Seacaucus, NJ, April 1992.

185.     Proceedings, 1990 IEMT Symposium, “Competitive Manufacturing for the Next Decade, October 1-3, 1990, Washington, DC.

186.     Proceedings of the Technical Program, NEPCON West ’92, February 23-27, 1992,

187.     Anaheim, CA.

188.     (three volumes)

189.     ITherm 2000 Proceedings, 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (two volumes), May 23-26, 2000, Las Vegas, NV.

190.     2000 Proceedings, International Symposium on Microelectronics, IMAPS, September 20-22, 2000, Boston, MA.

191.     13th Annual International Conference on Micro Electro Mechanical Systems (MEMS 2000), January 23-27, 2000, Miyazaki, Japan.

192.     Electronic Components & Technology Conference, 50th ECTC, May 21-24, 2000, Las Vegas, NV.

193.     Proceedings of the ASME Manufacturing Engineering Division 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, FL.

194.     APEX 2001, Proceedings of the Technical Conference, Long Beach, CA, January 14-18, 2001 (3 copies).

195a.   IPC Fifth Annual National Conference on High Density Interconnect Structures (HDIS), Workshops November 8, 2000, Tampa FL.

195b.   IPC Fifth Annual National Conference on High Density Interconnect Structures (HDIS), Technical Conference November 9-10, 2000, Tampa, FL.

196a.   Advances in Electronic Packaging 1993, Volume 1: Structural Analysis, Materials and Processes, Design Reliability, ASME International Electronics Packaging Conference, Binghamton, NY, September 29-October 2, 1993.

196b.   Advances in Electronic Packaging 1993, Volume 2: Thermal Management, Solder Technology, Optoelectronics Packaging, ASME International Electronics Packaging Conference, Binghamton, NY, September 29-October 2, 1993.

197.     Microelectromechanical Systems (MEMS) 1999, ASME, Nashville, TN, November 14-19, 1999.

198.     I.E.P.S. Proceedings of the Technical Conference, Austin, TX, September 29-October 1, 1996.

199.     IEEE BGA/Flip Chip Workshop, Technical Program Abstracts, Binghamton, NY, October 19-21, 1994.

200.     IEEE BGA/Flip Chip Workshop, Technical Program Abstracts, Binghamton, NY, October 23-25, 1996.

201.     ISHM International Symposium on Microelectronics, Philadelphia, PA, October 14-16, 1997.

202.     Fourth Annual Pan Pacific Microelectronics Symposium, Kaua’i, HI, February 2-5, 1999.

203.     2001 Proceedings, Pan Pacific Microelectronics Symposium, Kaua’i, HI, February 13-16, 2001.

204.     IMAPS 2000, 33rd International Symposium on Microelectronics, Boston, MA, September 20-22, 2000.

205.     Nepcon East ’99, Proceedings of the Technical Program, Boston, MA, June 14-17, 1999.

206.     Professional Development Course, HDInternational 2001, Santa Clara, CA, April 17, 2001.

207.     HD International Proceedings 2001, International Conference and Exhibition on High Density Interconnect and Systems Packaging, Santa Clara, CA, April 17-20, 2001.

208.     51st Electronics Components & Technology Conference (ECTC) 2001, Orlando, FL, May 29-June 1, 2001.

209.     IMAPS 2001, Baltimore, MD, October 9-11, 2001.

APEX Technical Conference, San Diego, CA, January 19-24, 2002.

26th International Symposium for Testing and Failure Analysis, ISTFA 2000, Bellevue, WA, November 12-16, 2000.

52nd Electronics Components & Technology Conference (ECTC) 2002, San Diego, CA. May 28-31, 2002.

1998 Pan Pacific Microelectronics Symposium, Mauna Lani, HI, February 10-13, 1998.

EMIT ’98, Second Int’l Conference on Emerging Microelectronics & Interconnection Technologies, Bangalore, India, February 16-20, 1998.

215.     “Development of a Computerized Packaging Materials Database” (two copies), SRC Packaging Program Review, Tucson, AZ, March 18, 1997

216.     Speaker Notes Volume I, Electronics Packaging Symposium - Optoelectronics, Binghamton, NY, October 21-23, 2002.

217.     Speaker Notes Volume II, Electronics Packaging Symposium - Optoelectronics, Binghamton, NY, October 21-23, 2002.

218.     Poster Sessions and Research Reports, Electronics Packaging Symposium - Optoelectronics, Binghamton, NY, October 21-23, 2002.

219.     Technology Marketing Research Council 1999 Program, Volume 2 (December), 1999, Washington, D.C.

220.     Technology Marketing Research Council 2000 Program, Volumes 1 (June) and

221.     2 (December), 2000, Washington, D.C.

222.     Technology Marketing Research Council 2001 Program, Volume 1 (June) 2001, Washington, D.C.

223.     Nepcon East ’91, Proceedings of the Technical Program, Boston, MA, June 10-13, 1991.

224.     First International Academic Conference, Electronic Packaging and Education for the 21st Century, Georgia Institute of Technology, Atlanta, GA, March 18-20, 1998.

Second International Academic Conference, Georgia Institute of Technology, Atlanta, GA, March 17-19, 1999.

Albany Symposium 2003: The Global Business of Semiconductors & Nanotechnology, Lake George, NY, September 22-24, 2003.

Imaps, Microelectronics Marketing Research Council, Washington, DC, October 5-7, 2001.

Technology Marketing Research Council 2001 Program, Volume 1 (June) 1999, Washington, D.C.

SPIE: MEMS Design, Fabrication, Characterization, and Packaging (Volume 4407), Edinburgh, Scotland, UK, May 30-June 1, 2001.

SPIE: Reliability, Testing, and Characterization of MEMS/MOEMS (Volume 4558), San Francisco, CA, October 22-24, 2001.

231.     Printed Circuit World Convention VII, Basel, Switzerland, May 21-24, 1996

232.     Semicon West 99, 2nd Annual Semiconductor Packaging Symposium, San Jose, CA, July 13-14, 1999.

233.     Semicon West 2000, International Packaging Strategy Symposium, Technical Programs, San Jose, CA, July 13, 2000.

234.     Eighth Annual Pan Pacific Microelectronics Symposium, Mauna Lani, HI, February 18-20, 2003

235.     24th IEEC/CPMT International Electronics Manufacturing Technology Symposium (IEMT), Austin, TX, October 18-19, 1999.

236.     3rd Annual SMTA Advanced Technologies Symposium, Boston, MA, June 11-12, 2002.

237.     SMTA International, Proceedings of the Technological Program, Rosemont, IL, September 22-26, 2002.

238.     Electronic Packaging Materials Science III, Materials Research Society Symposium Proceedings, Volume 108, Boston, MA, November 30-December 4, 1987.

239.     SMTA Pan Pacific Microelectronics Symposium, Big Island of Hawaii, January 17-19, 2006.

240.     IEEE 1996 International Symposium on Electromagnetic Compatibility, Santa Clara, CA, August 19-23, 1996.

241.     SEMI 3rd Annual Semiconductor Packaging Symposium, San Jose, California, July 11-12, 2000.

242.     IPC Works ’97, High Density Interconnections Conference, A Large Look at Microvias, Arlington, VA, October 5-9, 1997.

243.     6th International Conference and Exhibition on Multichip Modules, Denver Colorado, April 2-4, 1997.

244.     Advances in Electronic Packaging 1992, Physical Design Thermal Management Interconnection Technology Structural Analysis, Vol. 1-1.

245.     Advances in Electronic Packaging 1992, Materials and Processes Reliability Quality Control and NDE, Vol. 1-2.

246.     IPC Expo ’97, Proceedings of the Technical Conference, San Jose, CA, March 9-13, 1997.

247.     9th Annual 2004 Pan Pacific Microelectronics Symposium, Kahuku, Oahu, February 10-12, 2004.

248.     10th Annual 2005 Pan Pacific Microelectronics Symposium, Kauai, Hawaii, January 25-27, 2005.

249.     Eleventh Annual Soldering Technology and Interconnect Symposium, October 1-2, 1998, Binghamton, NY, Sponsored by the Office of Continuing Education, Watson School of Engineering, Binghamton University.

250.     Electronics Packaging Symposium, “Emerging Materials and Processes to Improve Reliability and Manufacturing,” (Volume I), June 25-27, 2001, Binghamton, NY, Sponsored by the Office of Continuing Education, Watson School of Engineering, Binghamton University.

251.     AMRC, The 2000 Market for Electronics Manufacturing Service Providers/Contract Assembly Companies, Northbrook, IL.

252.     Improvements/Alternatives to Mechanical Drilling of Printed Wiring Board Vias, ITRI Project Team #134, Interconnection Technology research Institute, August 29, 1995.

253.     Workshop on Ball Grid Arrays and Advanced Packaging (Flip Chips and Multichip Modules), Semiconductor Technology Center, Inc., Sunnyvale, August 30, 1993.

254.     New Millennium Electronics Manufacturing Challenges, November 17, 2000, Binghamton, NY, Sponsored by the Office of Continuing Education, Watson School of Engineering, Binghamton University.

255.     Poster Sessions and Research Reports, Electronics Packaging Symposium, Optoelectronics, October 21-23, 2002, Binghamton, NY, Sponsored by Binghamton University Watson School of Engineering Professional Development and IEEC.

256.     Speaker Notes (Volume I), Gary Kunis, October 21-23, 2002, Binghamton, NY, Sponsored by Binghamton University Watson School Office of Engineering Professional Development and IEEC.

257.     Speaker Notes (Volume II) Gary Kunis, October 21-23, 2002, Binghamton, NY, Sponsored by Binghamton University Watson School Office of Engineering Professional Development and IEEC.

258.     IMAPS International Advanced Technology Workshop on Flip Chip Technology (Abstracts and Final Program), Braselton, GA, March 12-14, 1999.

259.     SMTA International, Proceedings of the Contract Manufacturing Symposium, San Jose, CA, September 12-16, 1999.

 

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Last Updated: 1/11/12