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The Integrated Electronics Engineering Center

A New York State Center for Advanced Technology at Binghamton University

part of the

The New York State Center of Excellence in Small Scale Systems Integration and Packaging

In conjunction with

GE Global Research Center

and

the Binghamton Chapter of the

IEEE Components, Packaging and Manufacturing Technology Society (CPMT)

will present the

2013 Electronics Packaging Symposium

Technology Advances in Small Scale Systems and Microelectronics Packaging

at Binghamton University in Binghamton, NY

October 15th & 16th, 2013


The symposium will focus on promising new technologies and developments

that are now impacting the electronics industry. Participants will receive overviews and research reports

on a range of emerging technologies in the areas of:

 

Medical Electronics

Thermal Challenges

3-D Packaging

Sensors/MEMs

Power Electronics

High Temperature Electronics

Miniaturization

Flexible/Printed Electronics



 

                Contact:

                                 Bill Infantolino (binfanto@binghamton.edu ),

                                 Kaustubh Nagarkar (Nagarkar@research.ge.com ) 

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 4/26/13