2012 Electronics Packaging Symposium |
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Technology Advances in Small Scale Systems and Microelectronics Packaging |
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October 9-10, 2012, General Electric Global Research, Niskayuna, New York |
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Tuesday, October 9, 2012 |
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| 07:30 AM | - | 08:00 AM | Registration and Continental Breakfast (Gallery) | |||
| 08:00 AM | - | 08:20 AM |
Welcome and Opening Remarks : Jerry Trant, GE Global Technology Leader, Micro & Nano Structure Technologies |
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Keynote Session - Steinmetz Auditorium
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| 08:20 AM | - | 09:00 AM | 3D Packaging – A SEMATECH Perspective - Raj Jammy, Sematech | |||
| 09:00 AM | - | 09:40 AM | Gen3 Thermal Packaging Technology: Microfluidics and Thermal Interconnects - Avram Bar-Cohen, DARPA/University of Maryland | |||
| 09:40 AM | - | 10:00 AM | Break | |||
| 10:00 AM | - | 10:40 AM | Materials Science Challenges in the Packaging Technology Roadmap – Peter Brofman, IBM | |||
| 10:40 AM | - | 11:20 AM | Market and Technology Trends of Mobile Electronics - Mark Christensen, Prismark Partners | |||
| Steinmetz Auditorium | Langmuir Lyceum | |||||
| Thermal Challenges Chairs: Katie Rivera IBM and Emad Sammadiani, Binghamton University |
Handheld/Miniaturization Chairs: Vivian Ryan, Global Foundries and Nancy Stoffel, GE |
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| 11:30 AM | - | 12:00 PM | Data Center Measurement and Management Technologies - Hendrik Hamann, IBM | 3D Integration – A Corner Technology for Heterogeneous Integration - Pol Marchal, IMEC | ||
| 12:00 PM | - | 12:30 PM | Package Level Thermal-Mechanical Challenges - Kamal Sikka, IBM | Status and Challenges of 3-D Integration Using TSVs for Mobile Devices - Urmi Ray, Qualcomm | ||
| 12:30 PM | - | 01:40 PM | Lunch / Posters (Gallery) | |||
| 12:40 PM | - | 1:10 PM | Lunch Speaker – Shekhar Borkar, Intel - Ubiquitous Computing in the Coming Year—Technology Challenges and Opportunities (Steinmetz) | |||
| 01:40 PM | - | 02:10 PM | Overview of Electronics Cooling Research in GE - Yogen Utturkar, GE | Thermal Management and Reliability of Quantum Cascade Lasers (QCL) – Satish Chaparala, Corning Incorporated | ||
| 02:10 PM | - | 02:40 PM | Vapor Chamber Heat Spreaders for High Power and Packaging Density Electronic Systems - David Altman, Ratheon Integrated Defense Systems | Design of 3D Specific Systems - Paul Franzon, NCSU | ||
| Sensors/MEMS Chairs: Asif Chowdhury, ADI and David Lin, GE |
Power Electronics Chairs: Steve McKeown, BAE and Shakti Chauhan, GE |
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| 02:50 PM | - | 03:20 PM | MEMS Packaging – A Key Differentiator for Success - Marc Papageorge, Icintek | Embedding Technologies for Power Electronic Applications - Rolf Aschenbrenner, Fraunhoffer | ||
| 03:20 PM | - | 03:50 PM | Advanced Packaging and 3D Integration for MEMS and Integrated Circuits - Jeremy Muldavin, MIT Lincoln Laboratory | Trends of Power Electronic Packaging - Yong Liu, Fairchild Semiconductor Corporation | ||
| 03:50 PM | - | 04:10 PM | Break / Posters (Gallery) | |||
| 04:10 PM | - | 04:40 PM | Power MEMS and Their Packaging Challenges - Luc Frechette, University de Sherbrooke | Insulated Gate Bipolar Transistors (IGBT)in Hybrid Electrical Vehicle (HEV) Applications - Nathan Gill, BAE Systems | ||
| 04:40 PM | - | 05:10 PM | Graphene-Enabled Electronics: Devices and Interconnects - Bin Yu, SUNY Albany | Power Overlay Packaging Platform - Arun Gowda | ||
| 05:10 PM | - | 06:30 PM | Poster Session and Reception (Gallery) | |||
| 06:30 PM | - | 08:50 PM | Dinner Speaker: Ljubisa Stevanovic ,GE- Technology Trends in Power Packaging (Gallery) | |||
Wednesday, October 10, 2012 |
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| 07:30 AM | - | 08:00 AM | Continental Breakfast (Gallery) | |||
| Steinmetz Auditorium | Langmuir Lyceum | |||||
| Harsh Environments Chairs: Dave Shaddock, GE and Junghyun Cho, Binghamton University |
3-D Packaging Chairs: Lei Fu, AMD and Sungbae Park, Binghamton University |
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| 08:00 AM | - | 08:30 AM | Solder and Die Attach for High Temperature Electronic Packaging - Patrick McCluskey, University of Maryland | Measured Thermal Resistance of Microbumps in 3D Chip Stacks - Evan Colgan, IBM, T.J. Watson Research Center | ||
| 08:30 AM | - | 09:00 AM | Reliability of BiAgX Solder as a Drop-in-Solution for High Temperature Lead-Free Die-Attach - Hongwen Zhang, Indium Corporation | 2.5/3D IC Integration of Advanced Technology Node - Shan Gao, Global Foundries | ||
| 09:00 AM | - | 09:30 AM | Die Attach Techniques for High Temperature/Harsh Environment Packaging: A Shifting Melting Point - Pedro Quintero, University of Puerto Rico-Mayaguez |
Cu-Cu Direct Bonding for Next Generation Ultra-High Density 3D Interconnects - Brian Sapp, SEMATECH | ||
| 09:30 AM | - | 10:00 AM | Alumina Based 500C Electronic Packaging Systems and Future Development - Liang-Yu Chen, NASA/Ohio Space | Advanced Packaging Technologies for LED-Based Smart Lighting Systems – James Lu, RPI | ||
| 10:00 AM | - | 10:20 AM | Break | |||
| Steinmetz Auditorium | CR9 | |||||
| Flexible/Printed Electronics Chairs: Mark Poliks, Endicott Interconnect Technologies and Howard Wang, Binghamton University |
Emerging Interconnect Technologies Chairs: Martin Anselm, Universal Instruments and Jim Rose, GE |
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| 10:20 AM | - | 10:50 AM | NanoCopper Materials Platform for Electronic Packaging and Printed Electronics w/200°C Processing Temperature – Alfred Zinn, Lockheed Martin | Development of Through Glass Via (TGV) Substrates for 3D-IC Integration - Aric Shorey, Corning Incorporated | ||
| 10:50 AM | - | 11:20 AM | Ultra-Slim Flexible Glass for Electronic Applications - Sean Garner, Corning Incorporated | 3D-IC Markets and Technology Drivers - Charles Woychik, Invensas Corporation | ||
| 11:20 AM | - | 11:50 AM | Functional Devices via Additive Driven Self-Assembly and Nanoimprint Lithography: Towards Solution-Based R2R Fabrication - Jim Watkins, University of Massachusetts | Package-Interposer-Package (PIP) A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration - Rabindra Das, Endicott Interconnect Technologies, Inc. | ||
| 11:50 AM | - | 12:20 PM | Reliability of Thin Film Flexible Electronics - Sandeep Tonapi, Anveshak Technology and Knowledge Solutions | Front End of Line Through Silicon Via (FEOL-TSV) Fabrication - Subhash Sinde, Sandia National Labs | ||
| 12:20 PM | Symposium Adjourns | |||||
| 12:30 PM | Optional Networking Lunch | |||||
