The electronics packaging research group focuses on a broad range of issues related to packaging from the chip level all the way up to the system level. A partial list of research topics includes: materials selection and performance for devices and interconnect technologies, behavior of solder alloys, thermo-mechanical behavior, shock and vibration testing and thermal management at all levels of electronics packaging.
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Junghyun Cho Materials, microstructural design of advanced ceramics |
Seungbae Park Reliability of small-scale systems, advanced packaging solution, deformation and structural failure analysis |
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James Pitarressi Computational mechanics, vibration modeling and testing, opto-mechanical techniques, electronic packaging |
Bahgat Sammakia Heat transfer, electronics packaging |
