Electronics Packaging

The electronics packaging research group focuses on a broad range of issues related to packaging from the chip level all the way up to the system level. A partial list of research topics includes: materials selection and performance for devices and interconnect technologies, behavior of solder alloys, thermo-mechanical behavior, shock and vibration testing and thermal management at all levels of electronics packaging.

Junghyun Cho

Junghyun Cho
Associate Professor
jcho@binghamton.edu

Materials, microstructural design of advanced ceramics

Seungbae Park

Seungbae Park
Associate Professor
sbpark@binghamton.edu

Reliability of small-scale systems, advanced packaging solution, deformation and structural failure analysis

James Pitarresi

James Pitarresi
Professor
jmp@binghamton.edu

Computational mechanics, vibration modeling and testing, opto-mechanical techniques, electronic packaging

Bahgat Sammakia

Bahgat Sammakia
Professor
bahgat@binghamton.edu

Heat transfer, electronics packaging

Last Updated: 11/27/13