We study materials and mechanics to tackle various engineering problems encountered as a result of material failure. The emphasis is given to gain a basic understanding of material microstructures and properties and their relationships. For example, we have investigated structure-property relationships of thin films/coatings, mechanical behavior of materials at nano- and microscales, and microstructure design. In addition, we use the state of the art nanoscale experimental characterization techniques to investigate the fundamental properties of nanostructures, nanoscale interactions and nano devices, and study their applications. We also have extensive collaboration with industry to study the electronic packaging and reliability using numerical and experimental methods.
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Junghyun Cho Materials, microstructural design of advanced ceramics |
Changhong Ke Experimental nanomechanics, nanoscale adhesion and interfaces, and bio-inspired materials, nanocomposites, NEMS |
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Ronald Miles Vibrations, acoustics, fatigue, noise, biomechanics, Microelectromechanical Systems (MEMS) |
Seungbae Park Reliability of small-scale systems, advanced packaging solution, deformation and structural failure analysis |
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James Pitarressi Computational mechanics, vibration modeling and testing, opto-mechanical techniques, electronic packaging |
Howard Wang Polymers, soft materials, nanomaterials, nanotechnology, characterization, scatterying, printable electronics |