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Watson doctoral student’s paper wins prestigious award

Parthiban (Parthi) Arunasalam, a doctoral student in mechanical engineering, was awarded the Intel Best Student Paper Award in modeling or advanced packaging at the prestigious Electronic Components and Technologies Conference (ECTC) earlier this month.Titled “Smart Three Axis Compliant (STAC) Interconnect: An Ultra-High Density MEMS Based Interconnect for Wafer-Level Ultra-Thin Die Stacking Technology,” Arunasalam’s paper addressed development of electrical interconnects that will carry signals between chips when they are stacked on top of one another.

Harold Ackler, assistant professor of mechanical engineering and Arunasalam’s faculty advisor, explained that many current applications in products such as cell phones include chips as small as a human hair. “When chips are this thin, they become very fragile and break easily when even modest stresses are applied to them,” Ackler said. “The potential benefits of our research are that the connections may be mass produced using common methods, and more importantly, they are very flexible. The flexibility enables any relative displacements to be accommodated, and by doing so, we hope to prevent stresses from being transferred to chips, thereby minimizing the chances that they will break.”

Arunasalam’s recognition included receipt of a $2,500 check.
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Last Updated: 10/14/08