2011 Electronics Packaging Symposium
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Technology Advances in Small Scale Systems and Microelectronics Packaging
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October 10-11, 2011, Binghamton University, Binghamton, New York
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Monday, October 10, 2011 Engineering and Science Building
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| 07:30 AM |
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08:00 AM |
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Registration and Continental Breakfast |
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| 08:00 AM |
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08:20 AM |
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Welcome and Opening Remarks :
Bahgat Sammakia, Interim Vice President for Research and Director, the New York State Center of Excellence in Small Scale Systems Integration and Packaging
Jerry Trant, GE opening remarks, GE Global Technology Leader, Micro & Nano Structure Technologies
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Keynote Session – Room 2008
Technology Advances
Chairs: Bill Infantolino, Binghamton University, and Kaustubh Nagarkar, GE
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| 08:20 AM |
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09:00 AM |
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The New Dynamics of the Semiconductor Business - Tien Wu, Chief Operating Officer, ASE |
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| 09:00 AM |
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09:40 AM |
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Advanced Electric Power Systems -- Key Concepts and Technologies - Terry Ericsen, Office of Naval Research |
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| 09:40 AM |
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10:00 AM |
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Break |
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| 10:00 AM |
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10:40 AM |
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Stacked IC Packaging with TSV – True 3D without the Glasses - Klaus Hummler, SEMATECH |
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| 10:40 AM |
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11:20 AM |
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Advanced Package Trends - From LED to MPU - Brandon Prior, Prismark Partners |
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| 11:20 AM |
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11:40 AM |
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Break / Room Setup |
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ROOM 2008A
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ROOM 2008B
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Thermal Management
Chairs: Satish Chaparala, Corning and
Bruce Murray, Binghamton University |
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Handheld / Miniaturization
Chairs: Bill Chen, ASE and Marco Aimi, GE |
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| 11:40 AM |
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12:10 PM |
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Extremely Energy Efficient Chiller-less Data Centers Using Liquid Cooled Servers
- Madhu Iyenagar, IBM |
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Integrated EMI Shielding Technologies for RF Applications
- Yifan Guo, Skyworks Solutions, Inc |
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| 12:10 PM |
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12:40 PM |
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Energy Efficient Thermal Management of Data Centers Via Reduced Order Modeling Based Design
- Emad Samadiani, Binghamton University |
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Miniaturization in Electronic Packaging or Thin is In
- Bernd Appelt, ASE Group |
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| 12:40 PM |
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01:50 PM |
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Lunch / Posters |
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| 01:50 PM |
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02:20 PM |
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Packaging and Integration of Advanced Phase-Change Heatspreaders
- Shakti Chauhan, GE Global Research |
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Wafer Level Underfill for Small Gap, Fine Pitch, Flip Chip Laminate Packages
- Michael Gaynes, IBM T. J. Watson Research Center |
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Sensors / MEMS
Chairs: Asif Chowdhury, Analog Devices and
Bo Li, GE |
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Power Electronics
Chairs: Stephen McKeown, BAE Systems and
Brian Rowden, GE |
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| 02:30 PM |
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03:00 PM |
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Importance of Die to Package Interactions for MEMS
- Carl Raleigh, Analog Devices, Inc. |
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Ni/Sn Transient Liquid Phase Bonding Technology for High Temperature Operational Vehicle Application
- Sang Won Yoon, Toyota Research Institute of NA |
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| 03:00 PM |
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03:30 PM |
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Bio-molecule Integration for Sensors and Diagnostic Devices
- Ralf Lenigk, GE Global Research |
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High Temperature Silicon Carbide Power Modules for High Performance Systems
- Jared Hornberger, APEI |
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| 03:30 PM |
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03:50 PM |
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Break / Posters |
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| 03:50 PM |
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04:20 PM |
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Micro Packaging Technologies for MEMS and Integrated Microsystems
- Andrew Oliver, WIMS, University at Michigan |
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Thermal Management and Reliability of Power Electronic Systems
- Patrick McCluskey, University of Maryland College Park |
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| 04:20 PM |
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04:50 PM |
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One's Size Doesn't Fit All
- Rob O'Reilly, Analog Devices Inc. |
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Novel ACA as a Lead-free Alternative for small form factor and 3D Packaging
- S. Manian Ramkumar from Rochester Institute of Technology |
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| 04:50 PM |
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06:00 PM |
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Poster Session and Reception |
| 06:00 PM |
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06:30 PM |
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Transfer to Tau Bearcat Room, Binghamton University Events Center |
| 06:30 PM |
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08:30 PM |
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Dinner Speaker: Design for Innovative Simplicity, Steven Betza, Corporate Director, Electronics Engineering and Packaging, Lockheed Martin |
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Tuesday, October 11, 2011 Engineering and Science Building
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| 07:30 AM |
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07:50 AM |
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Continental Breakfast (Engineering and Science Building Rotunda) |
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ROOM 2008A
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ROOM 2008B
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Harsh Environments
Chairs: David Shaddock, GE and Junghyun Cho, Binghamton University |
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3-D Packaging
Chairs: Gamal Refai-Ahmed, and Sungbae Park, Binghamton University |
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| 07:50 AM |
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08:20 AM |
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Packaging Technologies for 500C SiC Electronics and Sensors
- Liangyu Chen - NASA |
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3D TSV Interconnect Technology: Process Challenges for High Volume Manufacturing
- Roger Quon, SEMATECH |
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| 08:20 AM |
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08:50 AM |
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Substrate and Silicon Carbide (SiC) Packaging Technologies for 300°C Application
- Tan Zhang, GE Global Research Center |
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3D IC Integration and Roadmap
- Lei Fu, AMD |
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| 08:50 AM |
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09:20 AM |
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Role of Alloying Elements in High-Temperature Solders
- Junghyun Cho, Binghamton University |
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Markets and Technology Drivers for 3D IC Packaging
- Chuck Woychik, Invensas Corporation |
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| 09:20 AM |
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09:50 AM |
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Thermo-mechanical Challenges from the best engineering practices prospective for TSV technology
- Gamal Refai-Ahmed |
| 09:50 AM |
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10:10 AM |
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Break |
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FLEXIBLE/PRINTED ELECTRONICS
Chairs: Mark Poliks, Endicott Interconnect Technologies and Peter Borgesen, Binghamton U |
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INTERCONNECTS
Chairs: George Westby, Universal Instruments and
Stan Weaver, GE |
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| 10:10 AM |
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10:40 AM |
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Inorganic/Organic Hybrid Materials for Photovoltaics on Flexible Substrates
- Wayne Jones, Binghamton University |
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Interconnection Technologies: Gate Keepers of Electronic Performance, Past Present and Future
- Joseph Fjelstad, Verdant Electronics |
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| 10:40 AM |
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11:10 AM |
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Projected future Army needs and Their Implications on Packaging
- Romeo Delrosario, Army Research Laboratory |
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Continuous Recrystallization of Pb-free Solder Joints in Thermo-mechanical Fatigue
- Liang Yin, Universal Instruments Corporation |
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| 11:10 AM |
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11:40 AM |
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Effect of Surface Texturing on Superoleophobicity and Contact Angle Hysteresis
- Kock-Yee Law, Xerox Corporation |
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Affordable High Performance RF Module Integration Methodology
- Yongjae Lee, GE Global Research |
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| 11:40 AM |
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12:10 PM |
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Printable and Flexible Electronics: Towards Materials Development and Device Fabrication
- Mark Poliks, Endicott Interconnect Technologies, Inc. |
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Robust Assembly of Fine Pitch Through-Molded-Via (TMV) Package-on-Package (PoP) Devices
- Brian Roggeman, Universal Instruments Corporation |
| 12:10 PM |
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Symposium Adjourns |
| 12:10 PM |
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Optional Networking Lunch (Engineering and Science Building Rotunda) |
| 01:15 PM |
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Optional Tours: Engineering and Science Building, Biotechnology Building-Analytical and Diagnostics Laboratory |
