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Agenda

2011 Electronics Packaging Symposium    

Technology Advances in Small Scale Systems and Microelectronics Packaging     

October 10-11, 2011, Binghamton University, Binghamton, New York

Monday, October 10, 2011 Engineering and Science Building

07:30 AM - 08:00 AM   Registration and Continental Breakfast
         
08:00 AM - 08:20 AM  

Welcome and Opening Remarks :

Bahgat Sammakia, Interim Vice President for Research and Director, the New York State Center of Excellence in Small Scale Systems Integration and Packaging

 

Jerry Trant, GE opening remarks, GE Global Technology Leader, Micro & Nano Structure Technologies

         
       

Keynote Session – Room 2008
Technology Advances
Chairs: Bill Infantolino, Binghamton University, and Kaustubh Nagarkar, GE

         
08:20 AM - 09:00 AM   The New Dynamics of the Semiconductor Business - Tien Wu, Chief Operating Officer, ASE
         
09:00 AM - 09:40 AM   Advanced Electric Power Systems -- Key Concepts and Technologies - Terry Ericsen, Office of Naval Research
         
09:40 AM - 10:00 AM   Break
         
10:00 AM - 10:40 AM   Stacked IC Packaging with TSV – True 3D without the Glasses - Klaus Hummler, SEMATECH
         
10:40 AM - 11:20 AM   Advanced Package Trends - From LED to MPU - Brandon Prior, Prismark Partners 
         
11:20 AM - 11:40 AM   Break / Room Setup
         
        ROOM 2008A
  ROOM 2008B
        Thermal Management
Chairs: Satish Chaparala, Corning and
Bruce Murray, Binghamton University
  Handheld / Miniaturization
Chairs: Bill Chen, ASE and Marco Aimi, GE
             
11:40 AM - 12:10 PM   Extremely Energy Efficient Chiller-less Data Centers Using Liquid Cooled Servers
- Madhu Iyenagar, IBM
  Integrated EMI Shielding Technologies for RF Applications
Yifan Guo, Skyworks Solutions, Inc
             
12:10 PM - 12:40 PM   Energy Efficient Thermal Management of Data Centers Via Reduced Order Modeling Based Design
- Emad Samadiani, Binghamton University
  Miniaturization in Electronic Packaging or Thin is In
- Bernd Appelt, ASE Group
         
12:40 PM - 01:50 PM   Lunch / Posters
         
01:50 PM - 02:20 PM   Packaging and Integration of Advanced Phase-Change Heatspreaders
- Shakti Chauhan, GE Global Research
  Wafer Level Underfill for Small Gap, Fine Pitch, Flip Chip Laminate Packages
- Michael Gaynes, IBM T. J. Watson Research Center
             
        Sensors / MEMS
Chairs: Asif Chowdhury, Analog Devices and
Bo Li, GE
  Power Electronics
Chairs: Stephen McKeown, BAE Systems and
Brian Rowden, GE
             
02:30 PM - 03:00 PM   Importance of Die to Package Interactions for MEMS
- Carl Raleigh, Analog Devices, Inc.
  Ni/Sn Transient Liquid Phase Bonding Technology for High Temperature Operational Vehicle Application
Sang Won Yoon, Toyota Research Institute of NA
             
03:00 PM - 03:30 PM   Bio-molecule Integration for Sensors and Diagnostic Devices
- Ralf Lenigk, GE Global Research
  High Temperature Silicon Carbide Power Modules for High Performance Systems
- Jared Hornberger, APEI
             
03:30 PM - 03:50 PM   Break / Posters
             
03:50 PM - 04:20 PM   Micro Packaging Technologies for MEMS and Integrated Microsystems
- Andrew Oliver, WIMS, University at Michigan
  Thermal Management and Reliability of Power Electronic Systems
- Patrick McCluskey, University of Maryland College Park
             
04:20 PM - 04:50 PM   One's Size Doesn't Fit All
- Rob O'Reilly, Analog Devices Inc.
  Novel ACA as a Lead-free Alternative for small form factor and 3D Packaging
- S. Manian Ramkumar from Rochester Institute of Technology
             
04:50 PM - 06:00 PM   Poster Session and Reception
06:00 PM - 06:30 PM   Transfer to Tau Bearcat Room, Binghamton University Events Center
06:30 PM - 08:30 PM   Dinner Speaker: Design for Innovative Simplicity, Steven Betza, Corporate Director, Electronics Engineering and Packaging, Lockheed Martin
         
       

Tuesday, October 11, 2011 Engineering and Science Building

07:30 AM - 07:50 AM   Continental Breakfast (Engineering and Science Building Rotunda)
        ROOM 2008A
  ROOM 2008B
        Harsh Environments
Chairs: David Shaddock, GE and Junghyun Cho, Binghamton University
  3-D Packaging
Chairs: Gamal Refai-Ahmed, and Sungbae Park, Binghamton University
             
07:50 AM - 08:20 AM   Packaging Technologies for 500C SiC Electronics and Sensors
Liangyu Chen - NASA
  3D TSV Interconnect Technology: Process Challenges for High Volume Manufacturing
- Roger Quon, SEMATECH
             
08:20 AM - 08:50 AM   Substrate and Silicon Carbide (SiC) Packaging Technologies for 300°C Application 
- Tan Zhang, GE Global Research Center 
  3D IC Integration and Roadmap
- Lei Fu, AMD
             
08:50 AM - 09:20 AM   Role of Alloying Elements in High-Temperature Solders
- Junghyun Cho, Binghamton University
  Markets and Technology Drivers for 3D IC Packaging
- Chuck Woychik, Invensas Corporation
             
09:20 AM - 09:50 AM  

 

  Thermo-mechanical Challenges from the best engineering practices prospective for TSV technology
Gamal Refai-Ahmed
09:50 AM - 10:10 AM   Break
        FLEXIBLE/PRINTED ELECTRONICS
Chairs: Mark Poliks, Endicott Interconnect Technologies and Peter Borgesen, Binghamton U 
  INTERCONNECTS
Chairs: George Westby, Universal Instruments and
Stan Weaver, GE
             
10:10 AM - 10:40 AM   Inorganic/Organic Hybrid Materials for Photovoltaics on Flexible Substrates
- Wayne Jones, Binghamton University
  Interconnection Technologies: Gate Keepers of Electronic Performance, Past Present and Future
- Joseph Fjelstad, Verdant Electronics
             
10:40 AM - 11:10 AM   Projected future Army needs and Their Implications on Packaging
- Romeo Delrosario, Army Research Laboratory
  Continuous Recrystallization of Pb-free Solder Joints in Thermo-mechanical Fatigue
- Liang Yin, Universal Instruments Corporatio
n
             
11:10 AM - 11:40 AM   Effect of Surface Texturing on Superoleophobicity and Contact Angle Hysteresis
- Kock-Yee Law, Xerox Corporation
  Affordable High Performance RF Module Integration Methodology
- Yongjae Lee, GE Global Research
             
11:40 AM - 12:10 PM   Printable and Flexible Electronics: Towards Materials Development and Device Fabrication
- Mark Poliks, Endicott Interconnect Technologies, Inc.
  Robust Assembly of Fine Pitch Through-Molded-Via (TMV) Package-on-Package (PoP) Devices
- Brian Roggeman, Universal Instruments Corporation
12:10 PM       Symposium Adjourns
12:10 PM       Optional Networking Lunch (Engineering and Science Building Rotunda)
01:15 PM       Optional Tours: Engineering and Science Building, Biotechnology Building-Analytical and Diagnostics Laboratory
Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 10/25/11