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Confirmed Presenters at 2011 Electronics Packaging Symposium

     

2011 Electronics Packaging Symposium

     

Keynote Speakers

     
 

Presenter Name

Presenter Organization

     
 

Tien Wu

ASE - Chief Operating Officer

 

Brandon Prior

Prismark Senior Consultant

 

TBA

Sematech

 

Terry Ericsen

Office of Naval Research 
     

Dinner Speaker

 

Steven Betza      Lockheed Martin Systems Integration – Corporate Director

 

Technical Session Topics 

     

Thermal Management, 3D Packaging, Sensors / MEMS, Power Electronics,Harsh Environments,

Interconnects, Handheld / Miniaturization, Flexible / Printed Electronics

     
 

Presenter Name

Presenter Organization

     
 

Dereje Agonafer

University of Texas at Arlington

 

Emad Samadiani 

Binghamton University 

 

Madhu Iyengar 

IBM 

 

Shakti Chauhan 

GE Global Research 

 

Andrew Oliver 

University of Michigan 

 

Ralf Lenigk 

GE Global Research 

 

Carl Raleigh 

Analog Devices 

 

Jared Hornberger 

APEI 

 

Stephen Kosteva 

BAE Systems 

 

Patrick McCluskey 

University of Maryland 

 

Tan Zhang 

GE Global Research 

 

Junghyun Cho 

Binghamton University 

 

Joseph Fjelstad 

Verdant Electronics 

 

Bill Burdick 

GE Global Research 

 

Brian Roggeman 

Universal Instruments 

 

Liang Yin 

Universal Instruments 

 

Bernd Appelt 

ASE 

 

Kock-Yee Law 

Kodak 

 

Sean Garner 

Corning 

 

Roger Quon

Sematech

 

Michael Su

AMD 

 

Charles Woychik

Tessera

 

Romeo Delrosario

Army Research Lab 

 

Dr. Sang Won Yoon

Toyota Technical Center
 

Dr. Liangyu Chen

NASA 
 

Rob OReilly

Analog Devices
 

Michael Gaynes

IBM 
Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 9/23/11