2011 Electronics Packaging Symposium |
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Keynote Speakers |
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Presenter Name |
Presenter Organization |
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Tien Wu |
ASE - Chief Operating Officer |
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Brandon Prior |
Prismark Senior Consultant |
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TBA |
Sematech |
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Terry Ericsen |
Office of Naval Research | |
Dinner Speaker |
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Steven Betza Lockheed Martin Systems Integration – Corporate Director
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Technical Session Topics |
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Thermal Management, 3D Packaging, Sensors / MEMS, Power Electronics,Harsh Environments, Interconnects, Handheld / Miniaturization, Flexible / Printed Electronics |
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Presenter Name |
Presenter Organization |
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Dereje Agonafer |
University of Texas at Arlington |
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Emad Samadiani |
Binghamton University |
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Madhu Iyengar |
IBM |
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Shakti Chauhan |
GE Global Research |
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Andrew Oliver |
University of Michigan |
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Ralf Lenigk |
GE Global Research |
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Carl Raleigh |
Analog Devices |
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Jared Hornberger |
APEI |
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Stephen Kosteva |
BAE Systems |
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Patrick McCluskey |
University of Maryland |
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Tan Zhang |
GE Global Research |
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Junghyun Cho |
Binghamton University |
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Joseph Fjelstad |
Verdant Electronics |
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Bill Burdick |
GE Global Research |
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Brian Roggeman |
Universal Instruments |
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Liang Yin |
Universal Instruments |
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Bernd Appelt |
ASE |
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Kock-Yee Law |
Kodak |
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Sean Garner |
Corning |
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Roger Quon |
Sematech |
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Michael Su |
AMD |
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Charles Woychik |
Tessera |
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Romeo Delrosario |
Army Research Lab |
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Dr. Sang Won Yoon |
Toyota Technical Center | |
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Dr. Liangyu Chen |
NASA | |
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Rob OReilly |
Analog Devices | |
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Michael Gaynes |
IBM | |
