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2011 Electronics Packaging Symposium Poster Listing

 


Title:   Liquid Cooling of a 3D Quad-Core Processor by Planar Flow and Impingement Flow in Microchannels
     
Presenter:   Anjali Chauhan
     
Authors:   Anjali Chauhan, Bahgat Sammakia, Kanade Ghose
     
Poster:   For poster click here.
     
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Title:   Analytical and experimental studies to determine the effective thermal conductivity of particulate thermal interface materials
     
Presenter:   Bo Dan
     
Authors:   Bo Dan, Bahgat G. Sammakia, Ganesh Subbarayan, Drew Davidson and Sandeep Mallampati
     
Poster:   For poster click here.
     
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Title:   A Multiscale Modeling of Thermoelectric Systems for Conversion Efficiency Optimization
     
Presenter:   Siyi Zhou
     
Authors:   Siyi Zhou, Bahgat G. Sammakia, Bruce White, Peter Borgesen
     
Poster:   For poster click here.
     
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Title:   Thermal modeling and life prediction of water-cooled hybrid concentrating PV/T collectors
     
Presenter:   Xinqiang Xu
     
Authors:   Xinqiang Xu, Bahgat G Sammakia, Bruce T Murray, Mark M Meyers
     
Poster:   For poster click here.
     
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Title:   Damage Evolution of SnAgCu Soldering Alloys in Cycling
     
Presenter:   Awni Qasaimeh
     
Authors:   Awni Qasaimeh, Younis Jaradat, Peter Borgesen
     
Poster:   For poster click here.
     
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Title:   Effects of Varying Amplitude Cycling on Pb-free Solder Joints
     
Presenter:   Junhao Chen
     
Authors:   Younis Jaradat, Junhao Chen, Jacob Owens, Awni Oasaimeh, Linlin Yang, Peter Borgesen
     
Poster:   For poster click here.
     
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Title:   Effects of Solder Joint Size and Interlacing Twinning on Hardness of Lead Free Solder Joints
     
Presenter:   Azmi Alazzam
     
Authors:   Azmi Alazzam, Tariq Tashtoush, Mohammad Halaweh, Suhas Chivukula, Babak Arfaei, Peter Borgesen
     
Poster:   For poster click here.
     
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Title:   Effects of Lead Free Solder Joint Configuration on Acceleration Factors in Thermal Cycling
     
Presenter:   Luke Wentlet
     
Authors:   Luke Wentlent, Michael Meilunas, Liang Yin, Babak Arfaei, Peter Borgeson
     
Poster:   For poster click here.
     
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Title:   Solder Pad Cratering
     
Presenter:   Mazin Obaidat
     
Authors:   Mazin Obaidat, Venkatesh Raghavan, Brian Roggeman and Peter Bprgeson
     
Poster:   For poster click here.
     
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Title:   Effects of solder joint size on mechanical properties and microstructure evolution during aging
     
Presenter:   Tariq Tashtoosh
     
Authors:   Tariq Tashtoush, Babak Arfaei, Peter Borgeson
     
Poster:   For poster click here.
     
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Title:   Reliability Study of Pb containing Solder Joints
     
Presenter:   Younis Jaradat
     
Authors:   Younis Jaradat, Awni Qasaimeh, Babak Arfaei, Pericles Kondos
     
Poster:   For poster click here.
     
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Title:   Synthesis of Zn3P2 film using low temperature chemical reflux method
     
Presenter:   Daniel VanHart
     
Authors:   Daniel VanHart, Siva P Adusumilli, Parag Vasekar, and Charles R. Westgate
     
Poster:   For poster click here.
     
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Title:   Boosting Efficiency of CdTe based Solar Cells
     
Presenter:   Lakshmi K. Ganta
     
Authors:   Lakshmi K.Ganta, Surya Rajendran, Tara Dhakal and Charles R. Westgate 
     
Poster:   For poster click here.
     
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Title:   Experimental Study of the High Cyclic Bending Fatigue of Thin Film on Flexible Substrate for Flexible Electronics Applications 
     
Presenter:   Mohammad M. Hamasha 
     
Authors:   Mohammad M. Hamasha, Khalid Alzoubi, Susan Lu, Charles R. Westgate 
     
Poster:   For poster click here.
     
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Title:   Influence of Poly(ethylene glycol) Degradation on Voiding, Sporadically Occurring in Solder Joints with Electroplated Cu 
     
Presenter:   Fred Wafula 
     
Authors:   F. Wafula, Y. Liu, L. Yin, P. Borgesen and N. Dimitrov 
     
Poster:   For poster click here.
     
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Title:   Multiobjective Optimization of Airflow and Temperature Distributions Using Artificial Neural Networks 
     
Presenter:   Z. Song 
     
Authors:   Z. Song  and B. T. Murray 
     
Poster:   For poster click here.
     
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Title:   Microstructural changes in binary Sn-Ag and ternary Sn-Ag-Cu lead free solders under different compositions and cooling rates. 
     
Presenter:   Francis Musyoka
     
Authors:   Francis Musyoka and Eric Cott 
     
Poster:   For poster click here.
     
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Title:   The Effect of Ag atoms on the nucleation of undercooled Sn 
     
Presenter:   Gregory J. Parks 
     
Authors:   Gregory J. Parks and Eric Cotts 
     
Poster:   For poster click here.
     
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Title:   Resin-Free Hybrid Silver Pastes for Thermal Interface Materials
     
Presenter:   Lianfeng Zou 
     
Authors:   Lianfeng Zou, Hsin-Yi Wu, Kaikun Yang, Liwei Huang, Howard Wang
     
Poster:   For poster click here.
     
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Title:   The IEEC Packaging Materials Database
     
Presenter:   Kyle LaFever
     
Authors:   Kyle LaFever, Wayne Jones  
     
Poster:   For poster click here.
     
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Title:   Vapor phase polymerization of poly (3,4-ethylenedioxythiophene) on flexible substrates for enhanced transparent electrodes 
     
Presenter:   Kenneth H. Skorenko 
     
Authors:   Kenneth H. Skorenko, Christopher M. Madl , Peter N. Kariuki , Jessica  Gendron , Louis F.J. Piper , Wayne E. Jones Jr.. 
     
Poster:   For poster click here.
     
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Title:   Low-Temperature Deposited SiO2 films for Low-k Dielectric Applicationsc
     
Presenter:   Shijun Yu
     
Authors:   Shijun Yu and Junghyun Cho 
     
Poster:   For poster click here.
     
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Title:   Preliminary Analysis of Overlay Registration Components for Roll-to-Roll Technology in Photolithography 
     
Presenter:   Denisse Yepez 
     
Authors:   Denisse Yepez,   Daryl L. Santos, Baghat Sammakia, Mark Poliks 
     
Poster:   For poster click here.
     
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Title:   A Scheduling Tool for Processing Large-Area Flexible Electronics 
     
Presenter:   Matthew Sommerhalter
     
Authors:   Matthew Sommerhalter and Daryl L. Santos
     
Poster:   For poster click here.
     
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Title:   Systematic Process Development for Roll-to-Roll Flexible Solar Cell Production
     
Presenter:   Joseph Weiss
     
Authors:   Joseph Weiss, Lei Zhu, Peter N. Kariuki, Ken Skorenko, Kyle LaFever, Wayne E Jones, Jr., Peter Borgesen
     
Poster:   For poster click here.
     
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Last Updated: 11/11/11