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Facilities

The New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP) brings together a wealth of expertise and infrastructure to advance research and development in small scale systems integration and packaging. Facilities are available to government, industry and academic partners for collaboration. These facilities are concentrated at the following areas: the Integrated Electronics Engineering Center (IEEC), the Center for Advanced Microelectronics Manufacturing (CAMM), the Center for Autonomous Solar Power (CASP), the Analytical and Diagnostics Laboratory (ADL), the Nanofabrication Laboratory at BU (NLAB) and the Energy-Smart Electronic Materials(ES2). We encourage you to visit these sites and learn more about our expertise and infrastructure.

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 3/4/14