The following equipment is available for research and prototype development.
The SPM is a very accurate stencil printer built for precision batch printing and prototype work. The standard magnetic tooling and PC-based control system allow for quick changeover and maximum flexibility. There are also several options that turn the base SPM into an ultra-fine-pitch printer with capabilities similar to those of more expensive automatic printers.
The automatic dispensing machine is a stand-alone liquid dispensing system for applications in surface-mount assembly and semiconductor packaging, industrial or automotive assembly, gasketing, research and development, process calibration and low-to-medium production. This 1818 CAMALOT dispensing system is an ideal platform for research and development labs.
Heller reflow ovens are used in soldering the surface-mount components by passing PCB assemblies on conveyor belts through a controlled, varying-temperature environment. It provides more efficient heat transfer from extra-high-volume, high-velocity, heating modules, producing temperature gradients of less than 2 Centigrade throughout the oven.
Equipment x-ray microscopy, a non-contact, non-destructive inspection method, reveals the interior details of components with high definition. The high clarity of an x-ray microscopic image of the inside of materials, components and assemblies provides reliable diagnosis and rapid detection of the causes of flaws.
Brookfield's employs a spindle immersed in the fluid sample to sense torque resistance when running at constant speed, giving the viscosity value online. It is used for the measurement of viscosity of solder paste, adhesives and underfill.
The ecosphere environmental chamber is a temperature- and humidity-control chamber used for moisture sensitivity analysis for non-hermetic devices. Microprocessor-based ramp control provides uniform and accurate temperature and humidity.
The rheometer is used as a characterization tool to analyze visco-elastic materials used in electronics packaging including solder paste, epoxy underfills and conductive adhesives. Relationships between rheological properties and the actual performance parameters of a material are used to improve the existing formulations.
The M-8AN Flip Chip Aligner Bonder is a microprocessor-controlled visible-optics system that permits rapid, repeatable alignment and bonding of a flipped die to a substrate. The M-8AN accommodates a variety of contact pads and can be programmed to use any combination of pressure, substrate heating and die heating (optional) to make reliable contacts.
Scanning acoustic microscopy is used for non-destructive views of internal discontinuities. Defects such as cracks, delaminations and voids are easily spotted using SAM. Acoustic microscopy detects the failure as well as indicates the source of the problem.
The refleX coordinate measuring machine features a lightweight, tabletop and bridge-type design with removable granite support. This machine is designed to accommodate moderate-sized work pieces with an economical table-mounted unit.
